发明申请
- 专利标题： High density bonding of electrical devices
- 专利标题（中）： 电气设备的高密度结合
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申请号： US10872235申请日： 2004-06-18
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公开(公告)号： US20050282355A1公开(公告)日： 2005-12-22
- 发明人: David Edwards , Jason Munn , Kouroche Kian , Reza Mehrabi , Ian Forster , Thomas Weakley
- 申请人： David Edwards , Jason Munn , Kouroche Kian , Reza Mehrabi , Ian Forster , Thomas Weakley
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/44 ; H01L21/46 ; H01L21/48 ; H01L21/50 ; H01L21/60 ; H01L21/603
摘要：
A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip.
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