公开(公告)号：US08062445B2

公开(公告)日：2011-11-22

申请号：US11834139

申请日：2007-08-06

Applicant: Kouroche Kian

Inventor： Kouroche Kian

IPC: B32B37/00

CPC classification number: G06K19/07749 ,  G06K19/07718 ,  G06K19/07752 ,  H01L2224/16

Abstract: A method of making a radio frequency identification (RFID) device includes temporarily adhering an RFID interposer to an antenna, and subsequently ultrasonically welding the interposer leads to the antenna. The temporary adhering may involve use of any of variety of suitable adhering materials, such as an adhesive, wax, or even water. The adhering and the ultrasonic welding may be parts of a process that involves mostly continuous movement of an antenna web that has multiple antennas on it. The adhering material temporarily holds the interposer in place prior to the ultrasonic welding, which is important in a process that involves a moving web. The adhering may be such that there is no material between the conductive material interposer leads, and conductive material of the antenna. This allows the ultrasonic welding to proceed without any need to push intervening material aside.

Abstract translation: 制造射频识别（RFID）装置的方法包括将RFID插入件临时粘附到天线，并且随后将插入器引线超声波焊接到天线。 临时粘附可以包括使用各种合适的粘合材料，例如粘合剂，蜡或甚至水。 粘附和超声波焊接可以是涉及其上具有多个天线的天线网的大部分连续移动的过程的部分。 粘附材料在超声波焊接之前暂时将插入件保持在适当位置，这在涉及移动网的过程中是重要的。 粘合可以是导电材料插入物引线和天线的导电材料之间不存在材料。 这允许超声波焊接进行，而不需要将介入材料推到一边。

公开(公告)号：US20080060750A1

公开(公告)日：2008-03-13

申请号：US11469370

申请日：2006-08-31

Applicant: Haochuan Wang ,  Ali Mehrabi ,  Stephen Li ,  Kouroche Kian ,  Xiaoming He ,  Peikang Liu

Inventor： Haochuan Wang ,  Ali Mehrabi ,  Stephen Li ,  Kouroche Kian ,  Xiaoming He ,  Peikang Liu

IPC: B65C9/18 ,  G08B13/14 ,  H01Q17/00 ,  H01R43/00

CPC classification number: G06K19/07749 ,  G06K19/077 ,  G06K19/07718 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49018 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for assembling a semiconductor device from a plurality of chips is disclosed. The method includes providing a penetrable carrier having a penetrable carrier substrate and an adhesive layer; providing a plurality of chips disposed on a surface of the adhesive layer; providing a second substrate; bringing the surface of the adhesive layer of the penetrable carrier close to the second substrate; pinning the plurality of chips against the second substrate through the penetrable carrier; and, moving the penetrable carrier away from the second substrate such that the plurality of pinned chips are removed from the surface of the adhesive layer on the penetrable carrier.

Abstract translation: 公开了一种从多个芯片组装半导体器件的方法。 该方法包括提供具有可穿透的载体基底和粘合剂层的可穿透载体; 提供设置在所述粘合剂层的表面上的多个芯片; 提供第二基板; 将可穿透载体的粘合剂层的表面接近第二基底; 通过可穿透的载体将多个芯片固定在第二基板上; 并且使可穿透的载体从第二基板移开，使得多个被钉扎的芯片从可穿透的载体上的粘合剂层的表面移除。

公开(公告)号：US20090038735A1

公开(公告)日：2009-02-12

申请号：US11834139

申请日：2007-08-06

Applicant: Kouroche Kian

Inventor： Kouroche Kian

IPC: B29C65/08

CPC classification number: G06K19/07749 ,  G06K19/07718 ,  G06K19/07752 ,  H01L2224/16

Abstract: A method of making a radio frequency identification (RFID) device includes temporarily adhering an RFID interposer to an antenna, and subsequently ultrasonically welding the interposer leads to the antenna. The temporary adhering may involve use of any of variety of suitable adhering materials, such as an adhesive, wax, or even water. The adhering and the ultrasonic welding may be parts of a process that involves mostly continuous movement of an antenna web that has multiple antennas on it. The adhering material temporarily holds the interposer in place prior to the ultrasonic welding, which is important in a process that involves a moving web. The adhering may be such that there is no material between the conductive material interposer leads, and conductive material of the antenna. This allows the ultrasonic welding to proceed without any need to push intervening material aside.

Abstract translation: 制造射频识别（RFID）装置的方法包括将RFID插入件临时粘贴到天线，并且随后将插入器引线超声波焊接到天线。 临时粘附可以包括使用各种合适的粘合材料，例如粘合剂，蜡或甚至水。 粘附和超声波焊接可以是涉及其上具有多个天线的天线网的大部分连续移动的过程的部分。 粘附材料在超声波焊接之前暂时将插入件保持在适当位置，这在涉及移动网的过程中是重要的。 粘合可以是导电材料插入物引线和天线的导电材料之间不存在材料。 这允许超声波焊接进行，而不需要将介入材料推到一边。

公开(公告)号：US20060252182A1

公开(公告)日：2006-11-09

申请号：US11122539

申请日：2005-05-04

Applicant: Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

Inventor： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

IPC: H01L21/00

CPC classification number: G06K19/07749 ,  H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract translation: 公开了一种制造诸如RFID组件的半导体器件的方法，其中安装到衬底的管芯阵列以第一节距间隔开，并且在阵列中的管芯的位置被可固化物质固定之后，去除衬底。 然后去除可固化物质，而不改变阵列中的模具的相对位置。 芯片阵列的全部或选定部分然后电连接到布置在相应阵列中的多个带或插入件。 在芯片阵列中的管芯之间的间距或间距可以在衬底移除之前或之后改变以匹配相应阵列中的带或插入件的间距。 还公开了使用本发明创造的RFID设备。

公开(公告)号：US07989313B2

公开(公告)日：2011-08-02

申请号：US12104156

申请日：2008-04-16

Applicant: Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

Inventor： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

IPC: H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/82 ,  H01L23/544 ,  H01L21/768

CPC classification number: G06K19/07749 ,  H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract translation: 公开了一种制造诸如RFID组件的半导体器件的方法，其中安装到衬底的管芯阵列以第一节距间隔开，并且在阵列中的管芯的位置被可固化物质固定之后，去除衬底。 然后去除可固化物质，而不改变阵列中的模具的相对位置。 芯片阵列的全部或选定部分然后电连接到布置在相应阵列中的多个带或插入件。 在芯片阵列中的管芯之间的间距或间距可以在衬底移除之前或之后改变以匹配相应阵列中的带或插入件的间距。 还公开了使用本发明创造的RFID设备。

公开(公告)号：US20060264006A1

公开(公告)日：2006-11-23

申请号：US11437033

申请日：2006-05-19

Applicant: Kouroche Kian ,  Xiao He

Inventor： Kouroche Kian ,  Xiao He

IPC: H01L21/00 ,  H01L21/30

CPC classification number: H01L21/3043 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies is spaced apart at a pitch matching the pitch of straps on a web of straps before they are mounted to a chip carrier substrate. The substrate is then cut into strips to form one or more linear aggregations of dies. The linear aggregation of dies is then transferred by an assembly mechanism onto the web of straps and electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed to match the pitch of the straps or interposers in the corresponding array before or after a wafer substrate is removed from the die array. An RFID device created using the process inventive is also disclosed.

Abstract translation: 公开了一种用于制造诸如RFID组件的半导体器件的工艺，其中，在将芯片阵列安装到芯片载体衬底之前，其中阵列阵列以匹配条带上的带的间距的间距分隔开。 然后将基材切成条带以形成一个或多个模具的线性聚集体。 然后，模具的线性聚集通过组装机构转移到带的网状物上，并电连接到以相应阵列布置的多个带或插入物。 在芯片阵列中的晶片衬底被移除之前或之后，可以改变管芯阵列中的管芯之间的间距或间距以匹配相应阵列中的带或插入件的间距。 还公开了使用本发明创造的RFID设备。

公开(公告)号：US06602790B2

公开(公告)日：2003-08-05

申请号：US10008808

申请日：2001-11-13

Applicant: Kouroche Kian ,  Ramin Heydarpour

Inventor： Kouroche Kian ,  Ramin Heydarpour

IPC: H01L21461

CPC classification number: G02F1/133305 ,  G02F1/13439 ,  G02F1/136 ,  H01L51/0021 ,  H01L51/0097 ,  H01L51/5206 ,  H01L51/5253 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S438/94 ,  Y10T428/24917 ,  Y10T428/31507

Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer. According to a preferred method, the excimer laser is employed and controlled to ablate portions of the at least one conductive layer without completely decomposing the at least one functional layer therebeneath.

公开(公告)号：US07560303B2

公开(公告)日：2009-07-14

申请号：US11557472

申请日：2006-11-07

Applicant: Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

Inventor： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

IPC: H01L21/00

CPC classification number: G06K19/07752 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/90 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/53543 ,  H01L2224/81 ,  H01L2224/0401

Abstract: A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

Abstract translation: 一种组装半导体器件的方法，包括以下步骤：提供具有粘合剂表面的可穿透基底和设置在粘合剂表面上的多个管芯; 提供具有设置在其上的多个带状引线的带状引线基底; 从所述多个带状引线分配第一多个带状引线; 提供多个销; 使所述可穿透基板与所述带状引线基板紧密接合，以使所述第一多个带状引线与所述多个管芯接触; 使用所述多个销将所述第一多个带引线压靠所述多个管芯; 以及在使用所述多个销以保持所述第一多个带状引线和所述多个管芯之间的接触的同时将所述可穿透基板移离所述带状引线基板。 还公开了一种用于组装半导体器件的装置。

公开(公告)号：US20080194059A1

公开(公告)日：2008-08-14

申请号：US12104156

申请日：2008-04-16

Applicant: Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

Inventor： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

IPC: H01L21/58

CPC classification number: G06K19/07749 ,  H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract translation: 公开了一种制造诸如RFID组件的半导体器件的方法，其中安装到衬底的管芯阵列以第一节距间隔开，并且在阵列中的管芯的位置被可固化的物质固定之后，去除衬底。 然后去除可固化物质，而不改变阵列中的模具的相对位置。 芯片阵列的全部或选定部分然后电连接到布置在相应阵列中的多个带或插入件。 在芯片阵列中的管芯之间的间距或间距可以在衬底移除之前或之后改变以匹配相应阵列中的带或插入件的间距。 还公开了使用本发明创造的RFID设备。

公开(公告)号：US07364983B2

公开(公告)日：2008-04-29

申请号：US11122539

申请日：2005-05-04

Applicant: Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

Inventor： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

IPC: H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/82 ,  H01L23/544 ,  H01L21/768

CPC classification number: G06K19/07749 ,  H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract translation: 公开了一种制造诸如RFID组件的半导体器件的方法，其中安装到衬底的管芯阵列以第一节距间隔开，并且在阵列中的管芯的位置被可固化的物质固定之后，去除衬底。 然后去除可固化物质，而不改变阵列中的模具的相对位置。 芯片阵列的全部或选定部分然后电连接到布置在相应阵列中的多个带或插入件。 在芯片阵列中的管芯之间的间距或间距可以在衬底移除之前或之后改变以匹配相应阵列中的条带或插入物的间距。 还公开了使用本发明创造的RFID设备。