发明申请
- 专利标题： Semiconductor package including a semiconductor device, and method of manufacturing the same
- 专利标题（中）： 包括半导体器件的半导体封装及其制造方法
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申请号： US11048870申请日： 2005-02-03
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公开(公告)号： US20050285230A1公开(公告)日： 2005-12-29
- 发明人: Hyeong-Seob Kim
- 申请人： Hyeong-Seob Kim
- 优先权： KR2004-49002 20040628
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L23/58 ; H05K3/28 ; H05K3/38
摘要：
A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be formed as a plurality of inner connection pads and a plurality of outer connection pads, an outermost resin layer pattern formed on the surface of the main body, and including a plurality of openings exposing the plurality of outer connection pads, and a metal oxide layer disposed between the plurality of metal wires and the outermost resin layer pattern. The plurality of inner and outer connection pads may be formed on a surface of the main body.
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