发明申请
- 专利标题： Heat sink and high thermal stability structure for CPP sensor
- 专利标题（中）： 散热片和CPP传感器的高热稳定性结构
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申请号： US10878821申请日： 2004-06-28
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公开(公告)号： US20050286178A1公开(公告)日： 2005-12-29
- 发明人: Hardayal Gill , Wen-Chien Hsiao
- 申请人： Hardayal Gill , Wen-Chien Hsiao
- 专利权人： HITACHI GLOBAL STORAGE TECHNOLOGIES
- 当前专利权人： HITACHI GLOBAL STORAGE TECHNOLOGIES
- 主分类号： G11B5/127
- IPC分类号： G11B5/127 ; G11B5/31 ; G11B5/33 ; G11B5/39 ; G11B5/40
摘要：
A current perpendicular to plane (CPP) sensor having a heat sink structure disposed beneath the strip height of the sensor. The heat sink is preferably in thermal contact with one of the shields/leads of the sensor while being electrically insulated from the other shield/lead.
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