发明申请
- 专利标题： Method and apparatus for reducing spin-induced wafer charging
- 专利标题（中）： 减少自旋晶片充电的方法和装置
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申请号： US10884714申请日： 2004-07-03
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公开(公告)号： US20060000109A1公开(公告)日： 2006-01-05
- 发明人: Hua-Tai Lin , Shih-Che Wang , Louie Liu , Chi-Hung Liao , Yi-Ming Dai
- 申请人： Hua-Tai Lin , Shih-Che Wang , Louie Liu , Chi-Hung Liao , Yi-Ming Dai
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 主分类号： C23G1/02
- IPC分类号： C23G1/02 ; F26B5/08 ; F26B17/24
摘要：
A novel method and apparatus for reducing or eliminating electrostatic charging of wafers during a spin-dry step of wafer cleaning is disclosed. The method includes rinsing a wafer, typically by dispensing a cleaning liquid such as deionized water on the wafer while spinning the wafer; and spin-drying the wafer by sequentially rotating the wafer in opposite directions. The apparatus includes a wafer support platform that is capable of sequentially rotating a wafer in opposite directions to spin-dry the wafer.
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