发明申请
US20060000636A1 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same
失效
具有分裂导电层的电路化基板，其制造方法，利用其组合的电气组件以及利用其的信息处理系统
- 专利标题： Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same
- 专利标题（中）： 具有分裂导电层的电路化基板，其制造方法，利用其组合的电气组件以及利用其的信息处理系统
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申请号： US10882167申请日： 2004-07-02
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公开(公告)号： US20060000636A1公开(公告)日： 2006-01-05
- 发明人: John Lauffer , James Larnerd , Voya Markovich
- 申请人： John Lauffer , James Larnerd , Voya Markovich
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K3/46
摘要：
A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.
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