Stacked package electronic device

Invention Application

US20060003494A1 Stacked package electronic device 有权

Title translation: 堆叠式封装电子器件

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Patent Title: Stacked package electronic device
Patent Title (中): 堆叠式封装电子器件
Application No.: US10880998

Application Date: 2004-06-30
Publication No.: US20060003494A1

Publication Date: 2006-01-05
Inventor: Delin Li
Applicant: Delin Li
Main IPC: H01L21/44
IPC: H01L21/44

Abstract:

An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.

Abstract(Chinese):

电气部件包括衬底，附接到衬底的第一集成电路，耦合到第一集成电路的金属部分和附接到第一集成电路的第二集成电路。金属部分夹在第一集成电路和第二集成电路之间。

Public/Granted literature

US07245003B2 Stacked package electronic device Public/Granted day:2007-07-17

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/44	....用H01L21/36至H01L21/428各组不包含的方法或设备在半导体材料上制造电极的