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    Reaction apparatus and method for manufacturing a CIGS absorber of a thin film solar cell
    1.
    发明授权
    Reaction apparatus and method for manufacturing a CIGS absorber of a thin film solar cell 有权
    用于制造薄膜太阳能电池的CIGS吸收体的反应装置和方法

    公开(公告)号：US09178090B2

    公开(公告)日：2015-11-03

    申请号：US13941012

    申请日：2013-07-12

    Applicant: Delin Li

    Inventor： Delin Li

    IPC: C23C16/54 ,  H01L21/67 ,  H01L31/0392 ,  H01L31/032 ,  C23C16/455

    CPC classification number: H01L31/03928 ,  C23C16/45561 ,  C23C16/545 ,  H01L21/67155 ,  H01L21/67161 ,  H01L21/67173 ,  H01L22/10 ,  H01L22/26 ,  H01L31/0322 ,  H01L31/18 ,  Y02E10/541

    Abstract: The present invention provides an apparatus and a method for manufacturing a CIGS absorber of a thin film solar cell. The apparatus includes a supply chamber configured to provide a flexible substrate coated with precursors. The apparatus further includes a reaction chamber coupled to the supply chamber for at least subjecting the precursors on the flexible substrate to a reactive gas at a first state to form an absorber material. Additionally, the apparatus includes a gas-balancing chamber filled with the reactive gas at a second state. The gas-balancing chamber is communicated with the reaction chamber for automatically updating the first state of the reactive gas to the second state. Moreover, the apparatus includes a control system to maintain the second state of the reactive gas in the gas-balancing chamber at a preset condition and to adjust the transportation of the flexible substrate through the reaction chamber.

    Abstract translation: 本发明提供一种用于制造薄膜太阳能电池的CIGS吸收体的装置和方法。 该设备包括供应室，其构造成提供涂覆有前体的柔性基材。 该装置还包括耦合到供应室的反应室，用于至少使柔性基板上的前体经受第一状态的反应性气体以形成吸收材料。 另外，该装置包括在第二状态下填充有反应性气体的气体平衡室。 气体平衡室与反应室连通，用于将反应气体的第一状态自动更新为第二状态。 此外，该装置包括将气体平衡室中的反应气体的第二状态保持在预设状态并调节柔性基板通过反应室的输送的控制系统。

    Metallized optical fibers and ferrules for optical fibers for direct attachment to photodiodes
    4.
    发明申请
    Metallized optical fibers and ferrules for optical fibers for direct attachment to photodiodes 失效

    公开(公告)号：US20050018975A1

    公开(公告)日：2005-01-27

    申请号：US10625255

    申请日：2003-07-23

    Applicant: Yen-Ping Ho ,  Delin Li

    Inventor： Yen-Ping Ho ,  Delin Li

    IPC: G02B6/42 ,  G02B6/36

    CPC classification number: G02B6/4202 ,  G02B6/4238

    Abstract: An optical component formed from a fiber directly coupled to a photodiode without any intervening optical components such as mirrors or lenses is disclosed. The optical component includes a stripped optical fiber having a core with a flat distal end that extends through a ferrule. The distal flat end of the core is printed with an annular coating of metal leaving a central portion of the core uncovered. The coated flat end of the core is initially aligned with an aperture or active area of a rear side of a back-illuminated photodiode which also includes a coating of metal. With the two parts in abutting engagement, a reflow or a partial melting process is carried out to directly couple the fiber core to the photodiode.

    Method for the connection and repair of flex and other circuits
    5.
    发明授权
    Method for the connection and repair of flex and other circuits 失效
    柔性和其他电路的连接和修复方法

    公开(公告)号：US06601292B2

    公开(公告)日：2003-08-05

    申请号：US09891697

    申请日：2001-06-26

    Applicant: Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

    Inventor： Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

    IPC: H05K300

    CPC classification number: H05K3/361 ,  H05K1/0293 ,  H05K1/117 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/053 ,  H05K2201/09127 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2203/0228 ,  H05K2203/175 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/4973 ,  Y10T29/49732

    Abstract: A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.

    Abstract translation: 用于制造和修复第一和第二电路之间的连接的方法，例如柔性电路。 物品10包括：具有第一和第二边缘14/16的柔性电介质基底12和布置在基底上或内部的多个导电电路迹线18，其中每个迹线从靠近第一边缘14延伸到接近第二边缘14 每个电路迹线18包括：靠近第一边缘14设置的第一连接特征20; 设置在第二边缘16附近的第二连接特征22; 以及设置在第一和第二边缘14/16之间的至少一个第三连接特征24。 第一，第二和第三连接特征20/22/24中的每一个是电镀通孔，电镀盲孔或安装垫。 本文10可以用于使用第一和第二连接特征20/22（例如通过焊接）将第一和第二电路50/60连接在一起。 如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品10以便呈现一组第三连接特征24，新的替换电路可以连接到该组。

    Method for protecting electronic components
    8.
    发明授权
    Method for protecting electronic components 失效
    保护电子部件的方法

    公开(公告)号：US5968386A

    公开(公告)日：1999-10-19

    申请号：US993112

    申请日：1997-12-18

    Applicant: Lakhi Nandlal Goenka ,  Delin Li ,  Daniel Phillip Dailey ,  Charles Frederick Schweitzer ,  Michael Bednarz ,  Brenda Joyce Nation

    Inventor： Lakhi Nandlal Goenka ,  Delin Li ,  Daniel Phillip Dailey ,  Charles Frederick Schweitzer ,  Michael Bednarz ,  Brenda Joyce Nation

    IPC: H05K3/28 ,  H05K5/06 ,  H05B1/00

    CPC classification number: H05K5/068 ,  H05K3/284

    Abstract: An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50. The desiccant element 50 includes: a case 51 having an internal chamber, an inlet orifice 58, and an outlet orifice 59, wherein the inlet and outlet orifices are each in communication with the internal chamber; a predetermined amount of desiccant material 53 contained within the internal chamber; a normally-open interior valve 54 situated between the inlet orifice 58 and the internal chamber; a normally-closed exterior valve 56 situated between the outlet orifice 59 and the internal chamber; and heating means 52 for selectably heating the desiccant material 53 preferably above a regeneration temperature thereof. The desiccant element 50 is situated such that at least the interior orifice 54 thereof is sealably enclosed within the closed pocket 20.

    Abstract translation: 一种具有改善的防恶劣环境保护的电子电路，其优选实施例包括：具有顶表面12的基板10; 电子部件14，其安装在基板的上表面上; 塑料和金属箔层压壁板16，其周边具有外周边18，外周边密封地附接到基板的顶表面12，以便在顶表面12和阻挡层16之间形成封闭的袋20， 组件14被封闭; 干燥剂元件50包括：具有内部室的壳体51，入口孔58和出口孔59，其中入口孔和出口孔各自与内部室连通; 包含在内部室内的预定量的干燥剂材料53; 位于入口孔58和内室之间的常开内部阀54; 位于出口孔59和内室之间的常闭外部阀56; 以及用于可选地加热干燥剂材料53的加热装置52，优选地在其再生温度之上。 干燥剂元件50被定位成使得至少其内孔54密封地封闭在封闭的口袋20内。

    Method for manufacturing a front electrode of a semiconductor device
    9.
    发明授权
    Method for manufacturing a front electrode of a semiconductor device 有权
    半导体装置的前电极的制造方法

    公开(公告)号：US09508877B2

    公开(公告)日：2016-11-29

    申请号：US15155199

    申请日：2016-05-16

    Applicant: Xiaoli Liu ,  Delin Li

    Inventor： Xiaoli Liu ,  Delin Li

    IPC: H01L21/00 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/028 ,  H01L31/068 ,  H01L31/18

    CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

    Abstract: The present invention provides a method for manufacturing a front electrode of a semiconductor device. The method includes using an electrically conductive paste composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

    Abstract translation: 本发明提供一种半导体器件的前电极的制造方法。 该方法包括使用由无玻璃腐蚀粘合剂，金属粉末和有机载体构成的导电糊剂。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

    ELECTRICALLY CONDUCTIVE PASTE FOR FRONT ELECTRODE OF SOLAR CELL AND PREPARATION METHOD THEREOF
    10.
    发明申请
    ELECTRICALLY CONDUCTIVE PASTE FOR FRONT ELECTRODE OF SOLAR CELL AND PREPARATION METHOD THEREOF 审中-公开
    太阳能电池正极电气导电胶及其制备方法

    公开(公告)号：US20160260850A1

    公开(公告)日：2016-09-08

    申请号：US15155192

    申请日：2016-05-16

    Applicant: Xiaoli Liu ,  Delin Li

    Inventor： Xiaoli Liu ,  Delin Li

    IPC: H01L31/0224 ,  C09D5/24 ,  H01B1/22

    CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

    Abstract: The present invention provides an electrically conductive paste for a front electrode of a solar cell and a preparation method thereof. The electrically conductive paste is composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

    Abstract translation: 本发明提供一种太阳能电池的前电极用导电性糊剂及其制备方法。 导电糊料由无玻璃腐蚀粘合剂，金属粉末和有机载体组成。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

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