发明申请
US20060011488A1 Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
审中-公开
含有具有特定骨架和有机硫化合物的季胺化合物聚合物的铜电解溶液作为添加剂，以及使用其制造的电解铜箔
- 专利标题： Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
- 专利标题（中）： 含有具有特定骨架和有机硫化合物的季胺化合物聚合物的铜电解溶液作为添加剂，以及使用其制造的电解铜箔
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申请号： US10486861申请日： 2003-09-17
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公开(公告)号： US20060011488A1公开(公告)日： 2006-01-19
- 发明人: Masashi Kumagai , Mikio Hanafusa
- 申请人： Masashi Kumagai , Mikio Hanafusa
- 优先权： JP2002-373719 20021225
- 国际申请： PCT/JP03/11858 WO 20030917
- 主分类号： C25D3/38
- IPC分类号： C25D3/38
摘要：
There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.
公开/授权文献
- US3179854A Modular structures and methods of making them 公开/授权日：1965-04-20
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