公开(公告)号：US20080073219A1

公开(公告)日：2008-03-27

申请号：US11906663

申请日：2007-10-03

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D5/00

CPC分类号： C25D7/0614 ,  C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/26

摘要： The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton represented by undermentioned general formula (1) obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction. (In general formula (1), R1 and R2 are each selected from a group consisting of hydroxyalkyl groups, ether groups, aromatic groups, aromatic-substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups, A represents an epoxy compound residue, and n represents an integer greater than or equal to 1.)

公开(公告)号：US08449751B2

公开(公告)日：2013-05-28

申请号：US11906663

申请日：2007-10-03

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D1/04 ,  C25D7/06

CPC分类号： C25D7/0614 ,  C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/26

摘要： The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.

摘要翻译： 本发明的目的是获得使用阴极鼓制造的电解铜箔制成的薄型电解铜箔，使得粗糙表面侧（与光泽表面的相反侧）的表面粗糙度低。 特别地，本发明的目的是获得可以精细图案化并且在正常和高温下具有优异的伸长率和拉伸强度的电解铜箔。 该目的通过使用含有有机硫化合物和具有特定骨架的胺化合物的铜电解溶液来实现，所述特定骨架通过使胺化合物和其分子中具有一个或多个环氧基的化合物相加至加成 反应。

公开(公告)号：US20060011488A1

公开(公告)日：2006-01-19

申请号：US10486861

申请日：2003-09-17

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D3/38

CPC分类号： C25D3/38 ,  Y10T428/12993

摘要： There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.

摘要翻译： 在使用阴极鼓的电解铜箔的制造中，在粗糙表面侧（与光泽表面相反的一侧）获得具有小的表面粗糙度的薄型电解铜箔，更具体地说，是电解铜 箔，其允许精细图案化，并且在常温和高温下在伸长率和拉伸强度方面优异。 本发明提供一种铜电解液，其含有有机硫化合物和通过使具有二烷基氨基的丙烯酸类化合物的氮季铵化的化合物均聚而得到的季铵化合物聚合物，或将该化合物与其它化合物共聚 具有不饱和键，以及使用该电解液制造的电解铜箔。

公开(公告)号：US07777078B2

公开(公告)日：2010-08-17

申请号：US10531645

申请日：2003-10-10

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C07C223/00 ,  C07C211/00

CPC分类号： C25D3/38 ,  C25D1/04 ,  Y10T428/12903

摘要： The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.

摘要翻译： 本发明提供一种铜电解液，用于在使用阴极鼓的电解铜箔的制造中，在粗糙面（与光面相反的一侧）上获得具有低表面粗糙度的低轮廓电解铜箔， 更具体地，提供一种铜电解液，其用于获得在高频下具有优异的透射损耗特性的电解铜箔，可以精细地图案化，并且在常温和高温下都具有优异的伸长率和拉伸强度。 本发明的铜电解液含有（A）至少一种选自（a）由表氯醇与由仲胺化合物构成的胺化合物混合物与叔胺化合物反应而得到的季铵盐的季胺盐 胺化合物和（b）聚表氯醇季胺盐，和（B）有机硫化合物。

公开(公告)号：US20070042201A1

公开(公告)日：2007-02-22

申请号：US11586906

申请日：2006-10-26

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： B32B15/04 ,  B32B15/08 ,  C22C9/00

CPC分类号： C25D3/38 ,  H05K1/09 ,  Y10T428/31678 ,  Y10T428/31681

摘要： It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.

摘要翻译： 本发明的目的是在使用阴极鼓的电解铜箔的制造中获得在粗糙表面侧（与光泽表面相反的一侧）具有较小表面粗糙度的薄型电解铜箔 更具体地说是获得能够精细图案化的电解铜箔，并且在常温和高温下在伸长率和拉伸强度方面优异。 此外，本发明的目的是获得用于该目的的铜电解液。 该铜电解液含有有机硫化合物和具有特定骨架的季胺化合物作为添加剂。

公开(公告)号：US20050173256A1

公开(公告)日：2005-08-11

申请号：US10480710

申请日：2003-08-20

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D1/04 ,  C25D3/38 ,  H05K1/09

CPC分类号： C25D3/38 ,  H05K1/09 ,  Y10T428/31678 ,  Y10T428/31681

摘要： It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton expressed by the following general formula (1) which is obtained by an addition reaction between a compound which has one or more epoxy groups per molecule and an amine compound, followed by a quaternization of the nitrogen. (In general formula (1), R1 and R2 each indicate a group selected from the group consisting of a hydroxyalkyl group, an ether group, an aromatic group, an aromatic-substituted alkyl group, an unsaturated hydrocarbon group and an alkyl group, R3 indicates a benzyl group, an allyl group or an alkyl group, A indicates an epoxy compound residue, X1− indicates Cl−, Br or CH3SO4−, and n indicates an integer of 1 or greater.)

摘要翻译： 本发明的目的是在使用阴极鼓的电解铜箔的制造中获得在粗糙表面侧（与光泽表面相反的一侧）具有较小表面粗糙度的薄型电解铜箔 更具体地说是获得能够精细图案化的电解铜箔，并且在常温和高温下在伸长率和拉伸强度方面优异。 此外，本发明的目的是获得用于该目的的铜电解液。 该铜电解液含有作为添加剂的有机硫化合物和具有以下通式（1）表示的特定骨架的季胺化合物，其通过每分子具有一个以上环氧基的化合物与 胺化合物，然后氮化季铵化。 （通式（1）中，R 1和R 2各自表示选自羟基烷基，醚基，芳香族基团， 芳族取代的烷基，不饱和烃基和烷基，R 3表示苄基，烯丙基或烷基，A表示环氧化合物残基，X 1， / SUB> 表示Cl - O，Br或CH 3 SO 4 - ，n表示1以上的整数。）

公开(公告)号：US20100270163A1

公开(公告)日：2010-10-28

申请号：US12803534

申请日：2010-06-29

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D7/00

CPC分类号： C25D3/38 ,  C25D1/04 ,  Y10T428/12903

摘要： The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.

公开(公告)号：US07678257B2

公开(公告)日：2010-03-16

申请号：US11974462

申请日：2007-10-12

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D1/04 ,  C25D3/38

CPC分类号： C25D3/38 ,  Y10T428/12993

摘要： There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which the nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.

摘要翻译： 在使用阴极鼓的电解铜箔的制造中，在粗糙表面侧（与光泽表面相反的一侧）获得具有小的表面粗糙度的薄型电解铜箔，更具体地说，是电解铜 箔，其允许精细图案化，并且在常温和高温下在伸长率和拉伸强度方面优异。 本发明提供一种铜电解液，其含有作为添加剂的有机硫化合物和通过使具有二烷基氨基的丙烯酸类化合物的氮季铵化的化合物均聚而得到的季胺化合物聚合物，或将该化合物与其它物质共聚 具有不饱和键的化合物和使用该电解液制造的电解铜箔。

公开(公告)号：US07378160B2

公开(公告)日：2008-05-27

申请号：US11187282

申请日：2005-07-22

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： B32B15/00 ,  B32B15/20

CPC分类号： C25D7/0614 ,  C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/26

摘要： The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton represented by undermentioned general formula (1) obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction. (In general formula (1), R1 and R2 are each selected from a group consisting of hydroxyalkyl groups, ether groups, aromatic groups, aromatic-substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups, A represents an epoxy compound residue, and n represents an integer greater than or equal to 1.)

摘要翻译： 本发明的目的是获得使用阴极鼓制造的电解铜箔制成的薄型电解铜箔，使得粗糙表面侧（与光泽表面的相反侧）的表面粗糙度低。 特别地，本发明的目的是获得可以精细图案化并且在正常和高温下具有优异的伸长率和拉伸强度的电解铜箔。 该目的通过使用含有作为添加剂的有机硫化合物的铜电解液和具有由下述通式（1）表示的特定骨架的胺化合物来实现，该胺化合物通过使胺化合物和具有一个或多个环氧基的化合物 在其分子中的基团进行加成反应。 （通式（1）中，R 1和R 2分别选自羟基烷基，醚基，芳香族基团，芳香族取代烷基，不饱和烃基和烷基，A表示环氧化合物残基， n表示大于或等于1的整数）

公开(公告)号：US20080075972A1

公开(公告)日：2008-03-27

申请号：US11974462

申请日：2007-10-12

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C22C9/00 ,  C25D1/04

CPC分类号： C25D3/38 ,  Y10T428/12993

摘要： There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.

摘要翻译： 在使用阴极鼓的电解铜箔的制造中，在粗糙表面侧（与光泽表面相反的一侧）获得具有小的表面粗糙度的薄型电解铜箔，更具体地说，是电解铜 箔，其允许精细图案化，并且在常温和高温下在伸长率和拉伸强度方面优异。 本发明提供一种铜电解液，其含有有机硫化合物和通过使具有二烷基氨基的丙烯酸类化合物的氮季铵化的化合物均聚而得到的季铵化合物聚合物，或将该化合物与其它化合物共聚 具有不饱和键，以及使用该电解液制造的电解铜箔。