发明申请
US20060011935A1 Light extraction from a semiconductor light emitting device via chip shaping
有权
通过芯片成形从半导体发光器件进行光提取
- 专利标题: Light extraction from a semiconductor light emitting device via chip shaping
- 专利标题(中): 通过芯片成形从半导体发光器件进行光提取
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申请号: US11230722申请日: 2005-09-19
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公开(公告)号: US20060011935A1公开(公告)日: 2006-01-19
- 发明人: Michael Krames , Fred Kish , Tun Tan
- 申请人: Michael Krames , Fred Kish , Tun Tan
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A method for designing semiconductor light emitting devices is disclosed wherein the side surfaces (surfaces not parallel to the epitaxial layers) are formed at preferred angles relative to vertical (normal to the plane of the light-emitting active layer) to improve light extraction efficiency and increase total light output efficiency. Device designs are chosen to improve efficiency without resorting to excessive active area-yield loss due to shaping. As such, these designs are suitable for low-cost, high-volume manufacturing of semiconductor light-emitting devices with improved characteristics.
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