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发明申请
US20060012005A1 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies 有权
用于制造包括适于在高频下使用的导体结构的部件的方法

  • 专利标题： Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
  • 专利标题（中）： 用于制造包括适于在高频下使用的导体结构的部件的方法
  • 申请号： US10515035
    申请日： 2003-05-23
  • 公开(公告)号： US20060012005A1
    公开(公告)日： 2006-01-19
  • 发明人: Jurgen Leib , Dietrich Mund
  • 申请人： Jurgen Leib , Dietrich Mund
  • 优先权： DE10222609.1 20020523
  • 国际申请： PCT/EP03/05415 WO 20030523
  • 主分类号： H01L23/48
  • IPC分类号： H01L23/48 ;  H01L21/4763
Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
摘要：
The invention provides a process for producing a substrate having a conductor arrangement that is suitable for radio-frequency applications, with improved radio-frequency properties. For this purpose, the process includes the steps of: depositing a structured glass layer having at least one opening over a contact-connection region by evaporation coating on the substrate, and applying at least one conductor structure to the structured glass layer so that the at least one conductor has electrical contact with the contact-connection region.
摘要（中）：

本发明提供一种制造具有适用于射频应用的导体装置的基板的方法，具有改进的射频特性。 为此，该方法包括以下步骤：在衬底上沉积通过蒸发涂层在接触连接区域上具有至少一个开口的结构化玻璃层，以及将至少一个导体结构施加到结构化玻璃层，使得在 至少一个导体与接触连接区域电接触。

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