发明申请
- 专利标题： Combined effusion and thick TBC cooling method
- 专利标题（中）： 组合积液和浓TBC冷却方法
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申请号： US10897788申请日： 2004-07-23
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公开(公告)号： US20060016191A1公开(公告)日： 2006-01-26
- 发明人: Gregory Woodcock , Charles Silcox , Thomas Strangman , Luis Flamand , Hiroshi Kawamura
- 申请人： Gregory Woodcock , Charles Silcox , Thomas Strangman , Luis Flamand , Hiroshi Kawamura
- 申请人地址： US NJ Morristown
- 专利权人： Honeywell International Inc.
- 当前专利权人： Honeywell International Inc.
- 当前专利权人地址： US NJ Morristown
- 主分类号： F23R3/42
- IPC分类号： F23R3/42
摘要：
A method for combined effusion and thick TBC cooling comprises a providing a substrate, depositing a thick TBC onto the substrate and laser drilling an array of effusion holes through the TBC coated substrate. The thick TBC has a columnar crack structure, which gives compliance and spall resistance. The microstructure of the segmentation microcracked TBC reduces cracking and chipping of the TBC during effusion hole laser drilling.
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