发明申请
- 专利标题： Electronic part-containing elements, electronic devices and production methods
- 专利标题（中）： 电子元器件，电子器件及生产方法
-
申请号： US11188723申请日： 2005-07-26
-
公开(公告)号： US20060017133A1公开(公告)日： 2006-01-26
- 发明人: Kiyoshi Oi , Yasuyoshi Horikawa , Akihito Takano
- 申请人： Kiyoshi Oi , Yasuyoshi Horikawa , Akihito Takano
- 申请人地址： JP Nagano
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址： JP Nagano
- 优先权： JP2004-217625 20040726
- 主分类号： H01L29/00
- IPC分类号： H01L29/00
摘要：
An electronic part-containing element used by being incorporated in an electronic device, in which the electronic part-containing element comprises an insulating support member which does not take part in the constitution of the electronic device but is removed in the process of producing the electronic device, and a circuit module supported by the support member, and the circuit module contains one or more electronic parts, each in the form of a thin film, therein and has connection terminals for the electronic part at least on the surface thereof that comes into contact with the support member.