摘要:
A connecting terminal structure includes a supporting body; a plurality of first electrode pads provided on a first side of the supporting body; a plurality of second electrode pads provided on a second side of the supporting body; a flexible substrate configured to electrically connect the first electrode pads to the second electrode pads; and a plurality of connecting terminals joined to at least one of the first electrode pads and the second electrode pads.
摘要:
A socket detachably connects a connecting item to a substrate via connecting terminals. The socket includes a support member with first and second surfaces to fix the connecting terminals, and penetrating holes formed in the support member. Each connecting terminal includes first and second connecting parts formed on opposite ends thereof. Each connecting terminal is inserted into a corresponding penetrating hole in a state in which the first connecting part is fixed to the first surface and the second connecting part projects from the second surface of the support member.
摘要:
A method of manufacturing an electronic part packaging structure including a step of mounting an electronic part, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a step of forming an insulating layer to cover the electronic part, a step of forming a via hole in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal, and a step of forming a wiring pattern, which is connected electrically to the connection terminal via the via hole, on the insulating layer.
摘要:
An electronic part-containing element used by being incorporated in an electronic device, in which the electronic part-containing element comprises an insulating support member which does not take part in the constitution of the electronic device but is removed in the process of producing the electronic device, and a circuit module supported by the support member, and the circuit module contains one or more electronic parts, each in the form of a thin film, therein and has connection terminals for the electronic part at least on the surface thereof that comes into contact with the support member.
摘要:
A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.
摘要:
A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.
摘要:
A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.
摘要:
A capacitor device of the present invention includes a substrate, a float electrode formed on the substrate, a valve metal film formed on the float electrode, a dielectric film formed on the valve metal film by applying an anodic oxidation to a part of the valve metal film, and a pair of electrodes provided in areas overlapping with two different parts of the float electrode on the dielectric film respectively.
摘要:
A connecting terminal structure includes a plurality of connecting terminals, each including a connecting part to be in contact with an object to be connected at an end of the connecting terminal and a plate-like fixing part at another end of the connecting terminal, a first face of the plate-like fixing part being configured to be electrically connectable; and electronic components, each including at least two electrode terminals, wherein the two electrode terminals of the electronic components are mounted on faces opposite to the first faces of the fixing parts of the connecting terminals.
摘要:
A connecting terminal structure includes a supporting body; a plurality of first electrode pads provided on a first side of the supporting body; a plurality of second electrode pads provided on a second side of the supporting body; a flexible substrate configured to electrically connect the first electrode pads to the second electrode pads; and a plurality of connecting terminals joined to at least one of the first electrode pads and the second electrode pads.