发明申请
- 专利标题: Carrier head for chemical mechanical polishing
- 专利标题(中): 化学机械抛光用载体头
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申请号: US10895574申请日: 2004-07-21
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公开(公告)号: US20060019586A1公开(公告)日: 2006-01-26
- 发明人: Andres Garcia , Jose Rodriguez , Charles Storey
- 申请人: Andres Garcia , Jose Rodriguez , Charles Storey
- 主分类号: B24B41/06
- IPC分类号: B24B41/06
摘要:
A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to the wear ring. This degree of freedom can accommodate height dimensional changes that may occur in the wear ring.
公开/授权文献
- US07033257B2 Carrier head for chemical mechanical polishing 公开/授权日:2006-04-25