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1.发明申请Method of manufacturing an integrated circuit to obtain uniform exposure in a photolithographic process 审中-公开制造集成电路以在光刻工艺中获得均匀曝光的方法公开(公告)号：US20070072128A1
公开(公告)日：2007-03-29
申请号：US11237569
申请日：2005-09-28
申请人： Frank Miceli , Jose Rodriguez , Andres Garcia , Charles Storey
发明人： Frank Miceli , Jose Rodriguez , Andres Garcia , Charles Storey
IPC分类号： G03F7/20
CPC分类号： G03F7/70783 , H01L21/0274
摘要： A method of manufacturing an integrated circuit in which the method comprises exposing a wafer to an energy source defining a focal plane with which a depth of focus is associated and conforming the wafer to substantially correspond with the focal plane.
摘要翻译： 一种制造集成电路的方法，其中所述方法包括将晶片暴露于限定焦平面的能量源，所述焦平面与所述焦平面相关联并且使所述晶片与所述焦平面基本对应。
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2.发明申请Method and System of Using Offset Gage for CMP Polishing Pad Alignment and Adjustment 失效用于CMP抛光垫对准和调整的偏移量规的方法和系统公开(公告)号：US20080102738A1
公开(公告)日：2008-05-01
申请号：US11968930
申请日：2008-01-03
IPC分类号： B24B7/00
摘要： A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.
摘要翻译： 提供了使用偏移表盘来对准和调整已经附着到化学机械抛光（CMP）装置的转盘上的抛光垫的方法和系统。 在所描述的实施例中，偏移表盘具有接触转盘侧面的表面，而传感器尖端接触位于转台上的抛光垫的边缘。 这提供了在该测量点处相对于转台侧的抛光垫边缘的径向位移的评估。 基于一个或多个这样的测量，可以发现抛光垫可接受地定位，可以被修整或可以被替换。 该方法和系统减少或消除与CMP转台相关的半导体晶片的侧面卸载发生的缺陷图案的发生。
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公开(公告)号：US20070010180A1
公开(公告)日：2007-01-11
申请号：US11175855
申请日：2005-07-06
IPC分类号： B24B41/06
CPC分类号： B24B37/32
摘要： Disclosed herein is an improved carrier design for use in a chemical mechanical polishing process. The carrier employs a retainer ring that is fastened to the side of carrier, as opposed to the front of the carrier, which alleviates undesired uneven wear of the retainer ring surface. Specifically exemplified herein is a carrier comprising a membrane that is secured to the carrier body by a retainer ring that is snap-fitted to the carrier body.
摘要翻译： 本文公开了一种用于化学机械抛光工艺的改进的载体设计。 载体采用紧固在载体侧面的保持环，与载体的前部相反，这减轻了保持环表面的不期望的不均匀磨损。 具体举例说明的是一种载体，其包括通过卡扣配合到载体主体的保持环固定到载体主体的膜。
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4.发明申请Method and system of using offset gage for CMP polishing pad alignment and adjustment 有权CMP抛光垫对准和调整使用偏移量计的方法和系统公开(公告)号：US20060068682A1
公开(公告)日：2006-03-30
申请号：US10953477
申请日：2004-09-29
IPC分类号： B24B51/00
摘要： A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.
摘要翻译： 提供了使用偏移表盘来对准和调整已经附着到化学机械抛光（CMP）装置的转盘上的抛光垫的方法和系统。 在所描述的实施例中，偏移表盘具有接触转盘侧面的表面，而传感器尖端接触位于转台上的抛光垫的边缘。 这提供了在该测量点处相对于转台侧的抛光垫边缘的径向位移的评估。 基于一个或多个这样的测量，可以发现抛光垫可接受地定位，可以被修整或可以被替换。 该方法和系统减少或消除与CMP转台相关的半导体晶片的侧面卸载发生的缺陷图案的发生。
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5.发明申请公开(公告)号：US20070042686A1
公开(公告)日：2007-02-22
申请号：US11205382
申请日：2005-08-17
CPC分类号： B24B37/345 , B08B3/02 , B24B55/00
摘要： Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.
摘要翻译： 这里公开了一种减少集成电路晶片的污染的方法，该集成电路晶片由布置在载体背面的残余浆料组分引起，用于接合集成电路晶片。 还公开了一种被配置为洗涤载体的背面的CMP机器。
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公开(公告)号：US20060019586A1
公开(公告)日：2006-01-26
申请号：US10895574
申请日：2004-07-21
申请人： Andres Garcia , Jose Rodriguez , Charles Storey
发明人： Andres Garcia , Jose Rodriguez , Charles Storey
IPC分类号： B24B41/06
摘要： A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to the wear ring. This degree of freedom can accommodate height dimensional changes that may occur in the wear ring.
摘要翻译： 提供了一种用于在化学机械抛光工艺期间支撑晶片的载体头。 在一个示例性实施例中，承载头可以包括耐磨环和设置在耐磨环内的可滑动地移动的压力板。 压板可以布置成提供相对于耐磨环的可滑动运动。 这种自由度可以适应磨损环中可能发生的高度尺寸变化。
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7.发明申请公开(公告)号：US20050260936A1
公开(公告)日：2005-11-24
申请号：US10851531
申请日：2004-05-21
CPC分类号： B24B53/017 , B24B53/12
摘要： A conditioner assembly is disclosed for conditioning a polishing pad used in chemical mechanical polishing of planar semiconductor wafer components. One embodiment of the conditioner assembly comprises a plate-type conditioner plate comprising a circular edge, having a first side and a second side, where on the first side is provided one or more diamond-impregnated abrasive elements, each comprising an abrasive surface disposed a distance from said first side comprising diamond particles, and one or more jets oriented to discharge fluid away from said first side. In operation the jets dispense high velocity fluid that hits the surface of the adjacent polishing pad with sufficient force to dislodge diamond particles that have loosened or broken off from the diamond-impregnated abrasive elements, thereby avoiding the embedding of such particles into the polishing pad surface. Another embodiment uses a ring-type conditioner plate assembly instead of a plate type, and also comprises one or more diamond-impregnated abrasive elements, each comprising an abrasive surface disposed a distance from said first side comprising diamond particles, and one or more jets oriented to discharge fluid away from said first side.
摘要翻译： 公开了一种用于调节在平面半导体晶片部件的化学机械抛光中使用的抛光垫的调节器组件。 调节器组件的一个实施例包括板式调节板，其包括具有第一侧和第二侧的圆形边缘，其中在第一侧上设置有一个或多个金刚石浸渍的研磨元件，每个包含研磨表面设置在 距离所述第一侧的距离包括金刚石颗粒，以及一个或多个喷射流，其定向成将流体从所述第一侧排出。 在操作中，喷射器分配高速流体，其以足够的力撞击相邻抛光垫的表面，以移除已经从金刚石浸渍的研磨元件松动或断裂的金刚石颗粒，从而避免将这种颗粒嵌入抛光垫表面 。 另一个实施例使用环形调节板组件而不是板式，并且还包括一个或多个金刚石浸渍的研磨元件，每个磨料元件包括与所述第一侧距离包括金刚石颗粒一定距离的研磨表面，以及一个或多个喷射取向 以将流体从所述第一侧排出。
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8.发明申请CHEMICAL MECHANICAL POLISHING PAD WITH GROOVES ALTERNATING BETWEEN A LARGER GROOVE SIZE AND A SMALLER GROOVE SIZE 失效化学机械抛光垫，具有更大的栅格尺寸和较小的沟槽尺寸之间的沟槽公开(公告)号：US20050202761A1
公开(公告)日：2005-09-15
申请号：US10799279
申请日：2004-03-12
申请人： Jose Rodriguez , Charles Storey , John Thompson
发明人： Jose Rodriguez , Charles Storey , John Thompson
IPC分类号： B24B1/00
CPC分类号： B24B37/26
摘要： A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and a groove of a second size, wherein the first and second groove sizes are different relative to one another.
摘要翻译： 提供化学机械抛光（CMP）垫。 CMP垫包括设置在垫的抛光表面上的凹槽图案。 凹槽图案由间隔开的凹槽的交替顺序形成。 槽的交替顺序包括第一尺寸的凹槽和第二尺寸的凹槽，其中第一和第二凹槽尺寸彼此不同。
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