发明申请
US20060019587A1 Methods for producing in-situ grooves in Chemical Mechanical Planarization (CMP) pads, and novel CMP pad designs
有权
在化学机械平面化（CMP）焊盘中制造原位槽的方法，以及新型的CMP焊盘设计
- 专利标题： Methods for producing in-situ grooves in Chemical Mechanical Planarization (CMP) pads, and novel CMP pad designs
- 专利标题（中）： 在化学机械平面化（CMP）焊盘中制造原位槽的方法，以及新型的CMP焊盘设计
-
申请号： US10897192申请日： 2004-07-21
-
公开(公告)号： US20060019587A1公开(公告)日： 2006-01-26
- 发明人: Manish Deopura , Hem Vaidya , Pradip Roy
- 申请人： Manish Deopura , Hem Vaidya , Pradip Roy
- 主分类号： B24D11/00
- IPC分类号： B24D11/00
摘要：
Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.