Invention Application
- Patent Title: Heat sink and heat spreader bonding structure
- Patent Title (中): 散热器和散热器结合结构
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Application No.: US10999928Application Date: 2004-12-01
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Publication No.: US20060021734A1Publication Date: 2006-02-02
- Inventor: Shih-Ying Chang , Tung-Han Chuang , Lan-Kai Yeh , Che-Wei Lin , Ming-Jye Tsai
- Applicant: Shih-Ying Chang , Tung-Han Chuang , Lan-Kai Yeh , Che-Wei Lin , Ming-Jye Tsai
- Priority: TW093122895 20040730
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat sink and heat spreader bonding structure includes a metal heat sink, a metal heat spreader, and an eutectic structure formed between the heat sink and the heat spreader by heating the heat sink and the heat spreader to a specific temperature of the eutectic temperature of the heat sink and the heat spreader but below the respective melting point of the heat sink and the heat spreader to cause the internal metal atoms of the heat sink and heat spreader to be rearranged. This bonding structure maintains the heat transfer efficiency of the bonding layer between the heat sink and the heat spreader, eliminates formation of crevice, heat resistance, and oxidation in the bonding layer.
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