利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

14 条记录 (耗时 0.013 秒)

    Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device
    1.
    发明授权
    Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device 失效
    提高液/气相散热装置工作流体流动性的方法

    公开(公告)号：US07011145B2

    公开(公告)日：2006-03-14

    申请号：US10887879

    申请日：2004-07-12

    申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

    发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

    IPC分类号： F28D15/00

    CPC分类号： F28F13/18 ,  F28D15/046 ,  F28F2245/02 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

    摘要： A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.

    摘要翻译： 在液/气相散热装置中提高工作流体的流动性的方法提高了工作流体的流动性，进一步提高了散热装置的散热能力。 本发明在散热装置内的毛细管结构的表面上涂覆一层，以增加表面上的材料性能和工作流体与毛细结构之间的耦合力，并降低工作流体和毛细管之间的接触角 结构，因此工作流体具有更高的流动性，以解决液/气散热装置的高热通量密度的问题，并提高散热效果。 本发明不仅适用于有限空间内的发热电子部件，而且也适用于需要恒定温度的其他电子部件。

    METHOD FOR ENHANCING MOBILITY OF WORKING FLUID IN LIQUID/GAS PHASE HEAT DISSIPATING DEVICE
    2.
    发明申请
    METHOD FOR ENHANCING MOBILITY OF WORKING FLUID IN LIQUID/GAS PHASE HEAT DISSIPATING DEVICE 失效
    用于提高液体/气相热交换装置中工作流体的移动性的方法

    公开(公告)号：US20060005951A1

    公开(公告)日：2006-01-12

    申请号：US10887879

    申请日：2004-07-12

    申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

    发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

    IPC分类号： F28D15/00

    CPC分类号： F28F13/18 ,  F28D15/046 ,  F28F2245/02 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

    摘要： A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.

    摘要翻译： 在液/气相散热装置中提高工作流体的流动性的方法提高了工作流体的流动性，进一步提高了散热装置的散热能力。 本发明在散热装置内的毛细管结构的表面上涂覆一层，以增加表面上的材料性能和工作流体与毛细结构之间的耦合力，并降低工作流体和毛细管之间的接触角 结构，因此工作流体具有更高的流动性，以解决液/气散热装置的高热通量密度的问题，并提高散热效果。 本发明不仅适用于有限空间内的发热电子部件，而且也适用于需要恒定温度的其他电子部件。

    METHOD FOR FABRICATING WICK MICROSTRUCTURES IN HEAT PIPES
    5.
    发明申请
    METHOD FOR FABRICATING WICK MICROSTRUCTURES IN HEAT PIPES 审中-公开
    在热管中制造微孔微结构的方法

    公开(公告)号：US20100229394A1

    公开(公告)日：2010-09-16

    申请号：US12785910

    申请日：2010-05-24

    申请人： Ming-Jye Tsai ,  Jin-Cherng Shyu ,  Cheng-Tai Chou ,  Chia-Sheng Chiang ,  Lan-Kai Yeh ,  Shao-Wen Chen

    发明人： Ming-Jye Tsai ,  Jin-Cherng Shyu ,  Cheng-Tai Chou ,  Chia-Sheng Chiang ,  Lan-Kai Yeh ,  Shao-Wen Chen

    IPC分类号： B21D53/02

    CPC分类号： F28D15/0233 ,  B23P2700/09 ,  F28D15/046 ,  F28F2255/18 ,  Y10T29/49353

    摘要： The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a dry powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.

    摘要翻译： 本发明提供了一种用于在热管中制造灯芯微结构的方法，包括以下步骤：提供具有多个成型孔的平板和模具; 在几个模制孔中填充干粉材料并将模具盖住平板以形成待烧结的物体; 烧结物体; 并移除模具以形成具有芯组织的平板。 油芯微结构以微槽，微气缸或它们的任何组合的形式布置在平板上。 进一步加工具有芯组织的平板，形成具有特征形状的热管，并具有两种芯组织，使得热管传递的热量增加，并且热管的干燥出现延迟。

    Method for fabricating wick microstructures in heat pipes
    8.
    发明申请
    Method for fabricating wick microstructures in heat pipes 审中-公开
    热管中芯芯微观结构的制作方法

    公开(公告)号：US20060143916A1

    公开(公告)日：2006-07-06

    申请号：US11132220

    申请日：2005-05-19

    申请人： Ming-Jye Tsai ,  Jin-Cherng Shyu ,  Cheng-Tai Chou ,  Chia-Sheng Chiang ,  Lan-Kai Yeh ,  Shao-Wen Chen

    发明人： Ming-Jye Tsai ,  Jin-Cherng Shyu ,  Cheng-Tai Chou ,  Chia-Sheng Chiang ,  Lan-Kai Yeh ,  Shao-Wen Chen

    IPC分类号： B23P6/00

    CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28F2255/18 ,  Y10T29/49353

    摘要： The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.

    摘要翻译： 本发明提供了一种在热管中制造灯芯微结构的方法，包括以下步骤：提供具有多个成型孔的平板和模具; 在多个模制孔中填充粉末材料并将模具盖住平板以形成待烧结的物体; 烧结物体; 并移除模具以形成具有芯组织的平板。 油芯微结构以微槽，微气缸或它们的任何组合的形式布置在平板上。 进一步处理具有芯组织的平板，形成具有特征形状的热管，并具有两种芯组织，使得热管传递的热量增加，并且热管的干燥出现延迟。

    Heat-dissipation device
    9.
    发明授权
    Heat-dissipation device 失效
    散热装置

    公开(公告)号：US06932150B1

    公开(公告)日：2005-08-23

    申请号：US10937611

    申请日：2004-09-10

    申请人： Lan-Kai Yeh ,  Ming-Jye Tsai ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu

    发明人： Lan-Kai Yeh ,  Ming-Jye Tsai ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu

    IPC分类号： A42B3/28

    CPC分类号： A42B3/285

    摘要： A heat-dissipation device adopted for a safety helmet which includes a heat-transfer unit that functions as a heat pipe, a heat-dissipation unit connecting to the heat-transfer unit, a vent formed in a front of the heat-dissipation unit that can be closed and opened alternatively by a shutter unit in order to adjust the capacity of heat-dissipation thereof, and a covering unit made of insulative materials and spreading over the heat-dissipation unit. Whereby the heat-transfer unit provides a kind of two-phase flow that is capable of conducting heat rapidly, so as to remove heat gathered in the helmet and improve the comfort level for the wearer.

    摘要翻译： 一种用于安全头盔的散热装置，其包括用作热管的传热单元，连接到传热单元的散热单元，形成在散热单元的前面的通风口， 可以通过快门单元交替地闭合和打开，以便调节其散热能力，以及由绝缘材料制成并覆盖在散热单元上的覆盖单元。 其中传热单元提供能够快速传导热量的一种两相流，以便去除聚集在头盔中的热量并提高穿着者的舒适度。