发明申请
- 专利标题： Integrated circuit chip utilizing oriented carbon nanotube conductive layers
- 专利标题（中）： 集成电路芯片利用定向碳纳米管导电层
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申请号： US10901858申请日： 2004-07-29
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公开(公告)号： US20060022221A1公开(公告)日： 2006-02-02
- 发明人: Toshiharu Furukawa , Mark Hakey , Steven Holmes , David Horak , Charles Koburger , Peter Mitchell
- 申请人： Toshiharu Furukawa , Mark Hakey , Steven Holmes , David Horak , Charles Koburger , Peter Mitchell
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L29/768
- IPC分类号： H01L29/768
摘要：
A conductive layer in an integrated circuit is formed as a sandwich having multiple sublayers, including at least one sublayer of oriented carbon nanotubes. The conductive layer sandwich preferably contains two sublayers of carbon nanotubes, in which the carbon nanotube orientation in one sublayer is substantially perpendicular to that of the other layer. The conductive layer sandwich preferably contains one or more additional sublayers of a conductive material, such as a metal. In one embodiment, oriented carbon nanotubes are created by forming a series of parallel surface ridges, covering the top and one side of the ridges with a catalyst inhibitor, and growing carbon nanotubes horizontally from the uncovered vertical sides of the ridges. In another embodiment, oriented carbon nanotubes are grown on the surface of a conductive material in the presence of a directional flow of reactant gases and a catalyst.