发明申请
- 专利标题: Cooling apparatus
- 专利标题(中): 冷却装置
-
申请号: US11195418申请日: 2005-08-01
-
公开(公告)号: US20060023424A1公开(公告)日: 2006-02-02
- 发明人: Kazuhiro Nakamura , Tetsuya Shimada , Katsuhiko Watabe
- 申请人: Kazuhiro Nakamura , Tetsuya Shimada , Katsuhiko Watabe
- 申请人地址: JP Osaka-shi
- 专利权人: ESPEC CORP.
- 当前专利权人: ESPEC CORP.
- 当前专利权人地址: JP Osaka-shi
- 优先权: JP2004-224841 20040730
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the water converted into mist onto the upper surface of a device attached to a socket of a burn-in board. The amount of heat generated by the device that generates a large amount of heat is removed via the heat including a large latent heat when the mist that falls on the upper surface is evaporated, and the burn-in is conducted, while the device is being cooled to the target temperature.
公开/授权文献
- US07558064B2 Cooling apparatus 公开/授权日:2009-07-07