- 专利标题: Semiconductor device and method of manufacturing the same
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申请号: US11244295申请日: 2005-10-06
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公开(公告)号: US20060027879A1公开(公告)日: 2006-02-09
- 发明人: Masato Koyama , Akira Nishiyama , Masamichi Suzuki , Yuuichi Kamimuta , Tsunehiro Ino
- 申请人: Masato Koyama , Akira Nishiyama , Masamichi Suzuki , Yuuichi Kamimuta , Tsunehiro Ino
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 优先权: JP2003-169700 20030613
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
A semiconductor device can be manufactured which has a low resistance, and device characteristics of which do not vary. The semiconductor device includes a silicon layer, a gate dielectric film formed on the silicon layer, a gate electrode formed on the gate dielectric film and including a nitrided metal silicide layer which is partially crystallized, and source and drain regions formed in a surface region of the silicon layer at both sides of the gate electrode.
公开/授权文献
- US07075158B2 Semiconductor device and method of manufacturing the same 公开/授权日:2006-07-11
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