A microelectronic package includes a microelectronic element having faces and contacts, and a flexible substrate spaced from and overlying a first face of the microelectronic element, the flexible substrate having conductive pads facing away from the first face of the microelectronic element. The package includes a plurality of spheres attached to the conductive pads of the flexible substrate and projecting away from the first face of the microelectronic element, each sphere having a contact surface remote from the conductive pads, the contact surfaces of the spheres including a contact metal devoid of solder. The package also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element, the spheres being offset from the support elements.