公开(公告)号：US20080032457A1

公开(公告)日：2008-02-07

申请号：US11904477

申请日：2007-09-27

申请人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

发明人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

IPC分类号： H01L21/00

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

摘要翻译： 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US20070096295A1

公开(公告)日：2007-05-03

申请号：US11641141

申请日：2006-12-19

申请人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

发明人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

IPC分类号： H01L23/12

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

公开(公告)号：US20050258529A1

公开(公告)日：2005-11-24

申请号：US11023826

申请日：2004-12-28

申请人： Ronald Green ,  David Tuckerman ,  Ron Barnett

发明人： Ronald Green ,  David Tuckerman ,  Ron Barnett

IPC分类号： H01L23/02 ,  H01L23/14 ,  H01L23/48 ,  H01L23/492 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H01L25/16 ,  H01L25/18

CPC分类号： H01L25/18 ,  H01L23/145 ,  H01L23/4922 ,  H01L23/5387 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

摘要： A microelectronic package is provided in which a first chip having active elements, e.g. amplifying elements, and passive elements, e.g. resistors, capacitors and inductors, is mounted in electrical communication with a microelectronic element having conductive patterns opposing a front face of the first chip. Absorptive material patterns are disposed between the conductive patterns of the microelectronic element and at least some of the passive elements while leaving at least some of the active elements exposed so as to attenuate radio frequency energy propagated by wave between the passive devices and conductive patterns of the microelectronic element. A packaged chip is also provided in which a chip is disposed beneath a package element, the chip having an opening which extends between a front face and a rear face of the chip, a conductor being disposed in the opening which is conductively connected to a conductive element of the package element.

摘要翻译： 提供一种微电子封装，其中具有有源元件的第一芯片，例如， 放大元件和无源元件，例如 电阻器，电容器和电感器安装成与具有与第一芯片的前表面相对的导电图案的微电子元件电连通。 吸收材料图案设置在微电子元件的导电图案和至少一些无源元件之间，同时使至少一些有源元件暴露，以便衰减由无源器件和无源器件的导电图案之间的波传播的射频能量 微电子元件。 还提供了一种封装芯片，其中芯片设置在封装元件下方，芯片具有在芯片的前表面和后表面之间延伸的开口，导体设置在开口中，该导体导电地连接到导电 包元素的元素。

公开(公告)号：US20070094874A1

公开(公告)日：2007-05-03

申请号：US11642570

申请日：2006-12-20

申请人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

IPC分类号： H05K1/11

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US20060109366A1

公开(公告)日：2006-05-25

申请号：US11265727

申请日：2005-11-02

申请人： Giles Humpston ,  Kenneth Honer ,  David Tuckerman

发明人： Giles Humpston ,  Kenneth Honer ,  David Tuckerman

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  G02B7/02 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49117 ,  H01L2924/00

摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.

摘要翻译： 电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。 光学单元（50）包括一个或多个光学元件，例如透镜（58）。 光学单元具有接合特征（64），其接合传感器单元上​​的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

公开(公告)号：US20060013680A1

公开(公告)日：2006-01-19

申请号：US11183635

申请日：2005-07-18

申请人： Belgacem Haba ,  David Tuckerman ,  Glenn Urbish ,  Masud Beroz ,  Ilyas Mohammed

发明人： Belgacem Haba ,  David Tuckerman ,  Glenn Urbish ,  Masud Beroz ,  Ilyas Mohammed

IPC分类号： B65G49/07

CPC分类号： H01L21/67144 ,  B23K26/066 ,  B23K26/0846 ,  B23K26/10 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An array of chips spaced apart from one another by chip spacing distances, as, for example, an array of chips on a wafer dicing tape is juxtaposed with an array of chip receiving elements spaced apart from one another by receiving element spacing distances different from the chip spacing distances, as, for example, an array of substrates or fixtures spaced apart from one another at distances substantially larger than the chip spacing distances. The juxtaposing step is performed so that a set of chips including less than all of the chips in the array of chips is aligned with a set of the chip receiving elements. This set of chips is transferred to the set of chip receiving elements while the arrays are aligned with one another. The cycle may be repeated using the same or different array of chips, and using the same or different array of chip receiving elements. Numerous small chips can be transferred to large chip receiving elements without handling individual chips, and without the use of equipment such as pick-and-place equipment commonly used for such handling.

摘要翻译： 通过芯片间隔距离彼此间隔开的芯片阵列，例如晶片切割带上的芯片阵列，与芯片接收元件阵列并列，通过接收元件间隔距离不同的芯片接收元件 芯片间隔距离，例如基板或固定装置的阵列，其距离基本上大于芯片间距距离彼此间隔开。 执行并置步骤，使得包括小于芯片阵列中的所有芯片的芯片组与一组芯片接收元件对准。 当阵列彼此对准时，这组芯片被传送到芯片接收元件组。 可以使用相同或不同的芯片阵列，并使用相同或不同的芯片接收元件阵列重复该周期。 许多小芯片可以转移到大的芯片接收元件而不处理单个芯片，并且不使用诸如通常用于这种处理的拾取和放置设备的设备。

公开(公告)号：US20050139984A1

公开(公告)日：2005-06-30

申请号：US11016034

申请日：2004-12-17

申请人： David Tuckerman ,  Richard Crisp ,  Belgacem Haba ,  Giles Humpston ,  Jae Park

发明人： David Tuckerman ,  Richard Crisp ,  Belgacem Haba ,  Giles Humpston ,  Jae Park

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L23/52 ,  H01L23/60 ,  H03H9/02 ,  H03H9/10

CPC分类号： H03H9/1092 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H9/02921 ,  H01L2924/00

摘要： According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the front and back surfaces of the chip. The cap includes a plurality of contacts which are conductively interconnected to the bond pads, and one or more temporary ties which conductively connect two or more of the contacts. The temporary ties are severable after the contacts are conductively interconnected to the bond pads.

摘要翻译： 根据本发明的一个方面，提供了一种封盖芯片，其包括具有前表面，与前表面相对的后表面的芯片和暴露在前表面和后表面中的至少一个上的多个接合焊盘。 盖子连接到芯片，盖子覆盖芯片的前表面和后表面之一。 盖包括导电地互连到接合焊盘的多个触点，以及一个或多个导电地连接两个或更多个触点的临时连接。 在触点与接合垫导电互连之后，临时接头是可分离的。

公开(公告)号：US20050095835A1

公开(公告)日：2005-05-05

申请号：US10949674

申请日：2004-09-24

申请人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

发明人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.

摘要翻译： 提供了覆盖芯片和形成封盖芯片的方法，其中电互连通过至少部分地通过盖的多个通孔从芯片的焊盘延伸的导电元件制成。 电互连可以是固体的，以便形成延伸穿过通孔的密封件。 在一些情况下，螺柱凸起从接合焊盘延伸，形成电互连的部分。 在一些情况下，可熔导电介质形成电互连的一部分。

公开(公告)号：US20050067681A1

公开(公告)日：2005-03-31

申请号：US10928839

申请日：2004-08-27

申请人： Catherine De Villeneuve ,  Giles Humpston ,  David Tuckerman

发明人： Catherine De Villeneuve ,  Giles Humpston ,  David Tuckerman

IPC分类号： H01L23/04 ,  H01L23/10 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H03H9/10

CPC分类号： H01L27/14618 ,  H01L23/04 ,  H01L23/10 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01S5/02248 ,  H01S5/02292 ,  H01S5/4025 ,  H04N5/2257 ,  H01L2224/05599

摘要： A covered chip having an optical element integrated in the cover is provided which includes a chip having a front surface, an optically active circuit area, and bond pads disposed at the front surface. The chip is covered by an at least partially optically translucent or transparent unitary cover that is mounted to the front surface of the chip, and has at least one optical element integrated in the unitary cover. The cover is further aligned with the optically active circuit area and vertically spaced from the optically active circuit area.

摘要翻译： 提供了具有集成在盖中的光学元件的覆盖芯片，其包括具有前表面，光学有效电路区域和设置在前表面的接合焊盘的芯片。 该芯片由至少部分光学的半透明或透明的整体盖子覆盖，该盖子安装到芯片的前表面，并且具有集成在整体盖中的至少一个光学元件。 盖子还与光学有源电路区域对准，并且与光学有源电路区域垂直地间隔开。

公开(公告)号：US20080029879A1

公开(公告)日：2008-02-07

申请号：US11711595

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

IPC分类号： H01L23/10 ,  H01L21/58

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Lidded chip packages are provided in which an optoelectronic device chip has microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the optoelectronic device and the microelectronic circuits. An opaque film may be attached to the lid to overlie the microelectronic circuits while exposing the optoelectronic device. Lidded chip packages are also provided in which the lid overlies an active or passive device mounted to the chip. Wiring traces may be embedded within an adhesive between the lid and the chip.

摘要翻译： 提供了带芯芯片封装，其中光电子器件芯片具有在芯片的表面处暴露在其上的微电子电路，其上安装有覆盖在光电子器件和微电子电路上的盖。 不透明的膜可以附着到盖子上以覆盖微电子电路，同时暴露光电子器件。 还提供了带盖的芯片封装，其中盖子覆盖安装在芯片上的有源或无源器件。 接线迹线可以嵌入在盖子和芯片之间的粘合剂中。