发明申请
- 专利标题： Method for connecting substrate and composite element
- 专利标题（中）： 连接基板和复合元件的方法
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申请号： US10511557申请日： 2003-04-15
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公开(公告)号： US20060030074A1公开(公告)日： 2006-02-09
- 发明人: Dietrich Mund , Jurgen Leib
- 申请人： Dietrich Mund , Jurgen Leib
- 优先权： DE20205830.1 20020415; DE10222958.9 20020523; DE10222964.3 20020523; DE10222609.1 20020523; DE10252787.3 20021113; DE10301559.0 20030116
- 国际申请： PCT/EP03/03907 WO 20030415
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/30 ; H01L21/44
摘要：
The invention relates to a process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element. The process is to be suitable for the substrates which are to be joined substantially irrespective of material and in particular also for sensitive substrates, is to have a high chemical and physical stability and/or is to produce a hermetic cavity. According to the invention, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.
公开/授权文献
- US07396741B2 Method for connecting substrate and composite element 公开/授权日：2008-07-08
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