- 专利标题： Laser separation of encapsulated submount
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申请号： US10911052申请日： 2004-08-04
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公开(公告)号： US20060030125A1公开(公告)日： 2006-02-09
- 发明人: Michael Sackrison , Xiang Gao , Bryan Shelton , Ivan Eliashevich
- 申请人： Michael Sackrison , Xiang Gao , Bryan Shelton , Ivan Eliashevich
- 专利权人： GELcore, LLC
- 当前专利权人： GELcore, LLC
- 主分类号： H01L21/78
- IPC分类号： H01L21/78
摘要：
In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
公开/授权文献
- US07087463B2 Laser separation of encapsulated submount 公开/授权日：2006-08-08
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