Lateral current GaN flip chip LED with shaped transparent substrate
    2.
    发明申请
    Lateral current GaN flip chip LED with shaped transparent substrate 审中-公开
    横向电流GaN倒装芯片LED带形状透明基板

    公开(公告)号:US20070096120A1

    公开(公告)日:2007-05-03

    申请号:US11260784

    申请日:2005-10-27

    IPC分类号: H01L31/12

    CPC分类号: H01L33/20

    摘要: An LED device (90) includes: an epitaxial structure (100) having a plurality of layers of semiconductor material and forming an active light-generating region (120) which generates light in response to electrical power being supplied to the LED device (90); and, a substrate (200) that is substantially transparent in a wavelength range corresponding to the light generated by the active light-generating region (120). The substrate has first and second opposing end faces (202, 206) and a plurality of side walls (210) extending therebetween, including a first side wall having a first portion thereof that defines a first surface (212, 214, 216, 218) which is not substantially normal to the first face (202) of the substrate (200). The epitaxial structure (100) is disposed on the first face (202) of the substrate (200).

    摘要翻译: LED器件(90)包括:具有多层半导体材料的外延结构(100),并形成响应供给LED器件(90)的电力产生光的有源发光区域(120) ; 以及在与由所述有源发光区域(120)产生的光对应的波长范围内基本透明的基板(200)。 衬底具有第一和第二相对的端面(202,206)和在其之间延伸的多个侧壁(210),包括第一侧壁,其具有限定第一表面(212,214,216,218)的第一部分, 其基本上不垂直于衬底(200)的第一面(202)。 外延结构(100)设置在基板(200)的第一面(202)上。

    KIWI PLANT NAMED 'AU GOLDEN TIGER'
    4.
    植物专利
    KIWI PLANT NAMED 'AU GOLDEN TIGER' 有权
    奇伟工厂名称“澳门金虎”

    公开(公告)号:US20110209256P1

    公开(公告)日:2011-08-25

    申请号:US12711204

    申请日:2010-02-23

    IPC分类号: A01H5/00

    CPC分类号: A01H5/08

    摘要: A new and distinct cultivar of the species Actinidia chinesis Planch is described. This cultivar named ‘AU Golden Tiger’ was developed from seeds collected from an open pollinated ‘AU Golden Dragon’ fruit. The seedling has been reproduced by rooted cuttings and grafting and tested in replicated cultivar trials. It maintains all of its unique characteristics after each propagation. Its bloom period overlaps the bloom period of ‘AU Golden Sunshine’ and is the pollinizer for ‘AU Golden Sunshine’.

    摘要翻译: 描述了猕猴桃猕猴桃的新的和独特的品种。 这个名为“澳大利亚金虎”的品种是从开放授粉的“澳大利亚金龙”水果的种子开发的。 通过根尖切割和移植复制幼苗,并在复制品种试验中进行测试。 它在每次传播后保持其所有的独特特征。 其开花期与“澳大利亚黄金阳光”的绽放期重叠,是“澳大利亚金阳光”的授粉者。

    GAN SEMICONDUCTOR BASED VOLTAGE CONVERSION DEVICE
    6.
    发明申请
    GAN SEMICONDUCTOR BASED VOLTAGE CONVERSION DEVICE 有权
    基于GAN半导体的电压转换器件

    公开(公告)号:US20060145674A1

    公开(公告)日:2006-07-06

    申请号:US11029266

    申请日:2005-01-05

    IPC分类号: G05F1/40 G05F1/618

    摘要: A converter is provided having an AC input and a DC output. The converter includes a rectifier that receives the AC input and that provides a rectifier output, a series connected current to magnetic field energy storage device and current interrupter connected across the rectifier output and a series connected gallium nitride diode and output charge storage device connected between a midpoint of the series connected magnetic field energy storage device and current interrupter and a terminal of the rectifier output and wherein the converter is characterized in not needing a transient voltage suppression circuit.

    摘要翻译: A转换器具有AC输入和DC输出。 该转换器包括一个接收AC输入并提供整流器输出的整流器,连接在整流器输出端的磁场能量存储装置和断流器的串联电流和串联的氮化镓二极管和输出电荷存储装置 串联连接的磁场蓄能装置的中点和电流断流器以及整流器输出的端子,其中转换器的特征在于不需要瞬态电压抑制电路。

    Thick laser-scribed GaN-on-sapphire optoelectronic devices
    7.
    发明申请
    Thick laser-scribed GaN-on-sapphire optoelectronic devices 审中-公开
    厚激光刻划蓝宝石蓝宝石光电器件

    公开(公告)号:US20050263854A1

    公开(公告)日:2005-12-01

    申请号:US11123796

    申请日:2005-05-06

    摘要: A sapphire wafer having a thickness greater than 125 microns and having devices disposed thereon is laser scribed to form a grid array pattern of laser scribe lines laser scribed into the sapphire wafer. The sapphire wafer is separated along the laser scribe lines to separate a plurality of device dice defined by the grid array pattern of laser scribe lines. Each device die includes (i) a device and (ii) a portion of the sapphire wafer having the thickness greater than 125 microns. In some embodiments, a GaN LED device die includes a GaN based LED device, and a sapphire substrate supporting the GaN based LED device. The sapphire substrate has: (i) a thickness greater than 125 microns effective for increased light extraction due to a lower critical angle for total internal reflection; and (ii) sides generated by laser scribing.

    摘要翻译: 激光刻划厚度大于125微米并具有设置在其上的器件的蓝宝石晶片,以形成激光刻划到蓝宝石晶片中的激光划线的栅格阵列图案。 沿着激光划线分离蓝宝石晶片以分离由激光划线的栅格阵列图案限定的多个器件裸片。 每个器件裸片包括(i)器件和(ii)蓝宝石晶片的厚度大于125微米的部分。 在一些实施例中,GaN LED器件管芯包括GaN基LED器件和支撑GaN基LED器件的蓝宝石衬底。 蓝宝石衬底具有:(i)厚度大于125微米,对于增加光提取有效,由于全内反射的临界角较小; 和(ii)通过激光划线产生的边。

    LED with series-connected monolithically integrated mesas
    8.
    发明申请
    LED with series-connected monolithically integrated mesas 有权
    LED串联单片集成台面

    公开(公告)号:US20050225973A1

    公开(公告)日:2005-10-13

    申请号:US10817603

    申请日:2004-04-02

    IPC分类号: H01L21/00 H01L27/15 H01L33/20

    摘要: A light emitting semiconductor device die (10, 110, 210, 310) includes an electrically insulating substrate (12, 112). First and second spatially separated electrodes (60, 62, 260, 262, 360, 362) are disposed on the electrically insulating substrate. The first and second electrodes define an electrical current flow direction directed from the first electrode to the second electrode. A plurality of light emitting diode mesas (30, 130, 130′, 230, 330) are disposed on the substrate between the first and second spatially separated electrodes. Electrical series interconnections (50, 150, 250, 350) are disposed on the substrate between neighboring light emitting diode mesas. Each series interconnection carries electrical current flow between the neighboring mesas in the electrical current flow direction.

    摘要翻译: 发光半导体器件管芯(10,110,210,310)包括电绝缘衬底(12,112)。 第一和第二空间分离的电极(60,62,260,262,360,362)设置在电绝缘基板上。 第一和第二电极限定从第一电极指向第二电极的电流流动方向。 多个发光二极管台面(30,130,130',230,330)设置在第一和第二空间分离的电极之间的衬底上。 在相邻的发光二极管台面之间的基板上设置电气串联互连(50,150,250,350)。 每个串联互连在电流流动方向上在相邻台面之间承载电流。