发明申请
- 专利标题： Micro-electromechanical structure with improved insensitivity to thermomechanical stresses induced by the package
- 专利标题（中）： 微机电结构改善了对包装引起的热机械应力的不敏感性
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申请号： US11201268申请日： 2005-08-10
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公开(公告)号： US20060032310A1公开(公告)日： 2006-02-16
- 发明人: Angelo Merassi , Bruno Murari , Sarah Zerbini
- 申请人： Angelo Merassi , Bruno Murari , Sarah Zerbini
- 申请人地址： IT Agrate Brianza
- 专利权人： STMicroelectronics S.r.I.
- 当前专利权人： STMicroelectronics S.r.I.
- 当前专利权人地址： IT Agrate Brianza
- 优先权： EP04425630.3 20040813
- 主分类号： G01P15/08
- IPC分类号： G01P15/08 ; H01L23/48
摘要：
In a micro-electromechanical structure, a rotor has a centroidal axis and includes a suspended structure which carries mobile electrodes. A stator carries fixed electrodes facing the mobile electrodes. The suspended structure is connected to a rotor-anchoring region via elastic elements. The stator includes at least one stator element, which carries a plurality of fixed electrodes and is fixed to a stator-anchoring region. One of the rotor-anchoring regions and stator-anchoring regions extends along the centroidal axis and at least another of the rotor-anchoring regions and stator-anchoring regions extends in the proximity of the centroidal axis.
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