发明申请
- 专利标题: Semiconductor device with sidewall wiring
- 专利标题(中): 具有侧壁接线的半导体器件
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申请号: US11206146申请日: 2005-08-18
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公开(公告)号: US20060033198A1公开(公告)日: 2006-02-16
- 发明人: Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
- 申请人: Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
- 申请人地址: JP Moriguchi-City
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Moriguchi-City
- 优先权: JP2002-120369 20020423; JP2002-185749 20020626
- 主分类号: H01L23/04
- IPC分类号: H01L23/04
摘要:
Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.
公开/授权文献
- US07271466B2 Semiconductor device with sidewall wiring 公开/授权日:2007-09-18