发明申请
US20060035029A1 Method to provide a layer with uniform etch characteristics 有权
提供具有均匀蚀刻特性的层的方法

Method to provide a layer with uniform etch characteristics
摘要:
The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes controlling variations in the characteristics of a solid layer, such etch characteristics over the area of the solid layer as a function of the relative rates of evaporation of the liquid components that comprise the composition from which the solid layer is formed.
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