- 专利标题： Through-wafer interconnects for photoimager and memory wafers
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申请号： US10932296申请日： 2004-09-02
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公开(公告)号： US20060043599A1公开(公告)日： 2006-03-02
- 发明人: Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
- 申请人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
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