发明申请
US20060049456A1 Insulated gate semiconductor device and method of manufacturing insulated gate semiconductor device 有权
绝缘栅半导体器件及制造绝缘栅半导体器件的方法

  • 专利标题: Insulated gate semiconductor device and method of manufacturing insulated gate semiconductor device
  • 专利标题(中): 绝缘栅半导体器件及制造绝缘栅半导体器件的方法
  • 申请号: US11216014
    申请日: 2005-09-01
  • 公开(公告)号: US20060049456A1
    公开(公告)日: 2006-03-09
  • 发明人: Koichi Sugiyama
  • 申请人: Koichi Sugiyama
  • 申请人地址: JP Tokyo
  • 专利权人: KABUSHIKI KAISHA TOSHIBA
  • 当前专利权人: KABUSHIKI KAISHA TOSHIBA
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2004-259206 20040907
  • 主分类号: H01L21/336
  • IPC分类号: H01L21/336 H01L29/94
Insulated gate semiconductor device and method of manufacturing insulated gate semiconductor device
摘要:
Disclosed is an insulated gate semiconductor device comprising: a first region having a gate electrode region and a first insulating film region surrounding the gate electrode region; a semiconductor region which includes a channel forming region and is disposed to oppose the gate electrode region with the first insulating film region between them; and a second region which has a conductor region buried in a semiconductor region not including the channel forming region disposed to oppose the gate electrode region with the first insulating film region between them, and has a second insulating film region which separates the conductor region from the semiconductor region.
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