发明申请
- 专利标题： Methods of making microelectronic assemblies including compliant interfaces
- 专利标题（中）： 制造微电子组件的方法包括兼容接口
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申请号： US11259398申请日： 2005-10-26
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公开(公告)号： US20060049498A1公开(公告)日： 2006-03-09
- 发明人: Zlata Kovac , Craig Mitchell , Thomas DiStefano , John Smith
- 申请人： Zlata Kovac , Craig Mitchell , Thomas DiStefano , John Smith
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
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