公开(公告)号：US06723584B2

公开(公告)日：2004-04-20

申请号：US10255297

申请日：2002-09-26

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L2148

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.

摘要翻译： 制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，例如在第一支撑结构的第一表面上具有第一表面和多孔弹性层的柔性电介质片，拉伸第一支撑结构并将 将第一支撑结构拉伸成环结构。 提供与第一支撑结构的第二表面接合的压板。 第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且在邻接步骤之后，第一可固化液体设置在第一和第二支撑结构之间以及多孔层内。 第一可固化液体可以至少部分固化。

公开(公告)号：US06525429B1

公开(公告)日：2003-02-25

申请号：US09517852

申请日：2000-03-02

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

公开(公告)号：US06870272B2

公开(公告)日：2005-03-22

申请号：US10123547

申请日：2002-04-16

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

公开(公告)号：US20050139986A1

公开(公告)日：2005-06-30

申请号：US11064630

申请日：2005-02-24

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/04 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US20060049498A1

公开(公告)日：2006-03-09

申请号：US11259398

申请日：2005-10-26

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

IPC分类号： H01L23/02

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US20140174847A1

公开(公告)日：2014-06-26

申请号：US14139030

申请日：2013-12-23

申请人： John Smith

发明人： John Smith

IPC分类号： H04R1/02

CPC分类号： H04R1/02 ,  H04R1/026 ,  H04R1/2846 ,  H04R1/2884

摘要： A speaker enclosure and method of building same is provided for redirecting standing waves outside the enclosure. The enclosure includes an exterior and an interior comprised of a body having six interior surfaces defining the interior. One of the surfaces has a speaker opening and another of the surfaces has a tuned port opening and defines four corners opposite the speaker opening. An element having an acoustically reflective surface faces the interior and is positioned in a plane that intersects and is inclined with respect to each of the interior surfaces that form the corner. A handle system that includes an attachment means is mounted to the exterior of the enclosure. A rotatable and detachable handle is mounted to the attachment means.

摘要翻译： 提供一种扬声器外壳及其构造方法，用于将驻波重定向在外壳外部。 外壳包括外部和内部，其由具有限定内部的六个内表面的主体构成。 一个表面具有扬声器开口，另一个表面具有调谐端口开口，并且限定与扬声器开口相对的四个角。 具有声反射表面的元件面向内部并且位于与形成角部的每个内表面相交并相对于每个内表面倾斜的平面中。 包括附接装置的把手系统安装在外壳的外部。 可旋转和可拆卸的手柄安装到附接装置。

公开(公告)号：US08618798B2

公开(公告)日：2013-12-31

申请号：US12935202

申请日：2009-03-27

申请人： Samuel Somasundaram ,  Andreas Jakobsson ,  Michael Rowe ,  John Smith ,  Naveed Razzaq Butt ,  Erik Gudmundson ,  Kaspar Althoefer

发明人： Samuel Somasundaram ,  Andreas Jakobsson ,  Michael Rowe ,  John Smith ,  Naveed Razzaq Butt ,  Erik Gudmundson ,  Kaspar Althoefer

IPC分类号： G01V3/00

CPC分类号： G01R33/441 ,  G01N24/08 ,  G01N24/10 ,  G01R33/4616 ,  G01R33/4625 ,  G01R33/5608

摘要： A method of testing a sample comprising the steps of: applying an excitation to the sample; detecting a response signal from the sample; processing a first part and a second part of the response signal; and determining from the second part of the response signal information with which to enhance the first part of the response signal.

摘要翻译： 一种测试样品的方法，包括以下步骤：向样品施加激发; 检测来自样品的响应信号; 处理响应信号的第一部分和第二部分; 并从响应信号的第二部分确定用于增强响应信号的第一部分的信息。

公开(公告)号：US08574000B1

公开(公告)日：2013-11-05

申请号：US13455252

申请日：2012-04-25

申请人： John Smith

发明人： John Smith

IPC分类号： H01R13/58

CPC分类号： H01R13/562 ,  H01R13/501 ,  H01R24/64

摘要： A protective sleeve disposed around a cable and a connector which are connected includes a cable sleeve and a plurality of resilient elements. The cable sleeve includes a bushing, a first ring, and a second ring. The front of the bushing is connected to the connector. The first ring and the second ring are disposed around the cable. The resilient elements are formed by extending the second ring and spaced apart from each other to form an opening for penetration by the cable. The caliber of the opening is less than the caliber of the second ring. Accordingly, the resilient elements are conducive to the positioning of the cable while the cable is penetrating the rings.

摘要翻译： 连接在电缆和连接器周围的保护套包括电缆套和多个弹性元件。 电缆套管包括衬套，第一环和第二环。 衬套的前部连接到连接器。 第一环和第二环设置在电缆周围。 弹性元件通过延伸第二环并彼此间隔开以形成用于穿过电缆的开口而形成。 开口的口径小于第二圈的口径。 因此，当电缆穿透环时，弹性元件有利于电缆的定位。

公开(公告)号：US07897049B2

公开(公告)日：2011-03-01

申请号：US11749448

申请日：2007-05-16

申请人： Rajat S. Ghosh ,  Dennis Fulmer ,  Kevin Kitzman ,  John Smith

发明人： Rajat S. Ghosh ,  Dennis Fulmer ,  Kevin Kitzman ,  John Smith

IPC分类号： C02F1/62 ,  C02F1/70 ,  C02F101/18 ,  C02F101/22

CPC分类号： C02F1/705 ,  C02F1/283 ,  C02F1/286 ,  C02F2101/103 ,  C02F2101/18 ,  C02F2101/22 ,  C02F2103/16 ,  C02F2209/04 ,  Y10S210/904 ,  Y10S210/911 ,  Y10S210/912 ,  Y10S210/913

摘要： Systems and associated methods for treating contaminant-containing wastewater are provided. The systems generally include a reducing zone for reducing the oxidation-reduction potential of the water and a clean-up zone comprising zero valent iron for removing at least a portion of the contaminant from the contaminant-containing water. The systems are operable to remove one or more contaminants from the contaminant-containing water and are operable for extended durations without clogging due to the formation of iron hydroxides.

摘要翻译： 提供了处理含污染废水的系统和相关方法。 该系统通常包括用于降低水的氧化还原电位的还原区和包含用于从含污染物的水中去除至少一部分污染物的零价铁的净化区。 该系统可操作以从含污染物的水中除去一种或多种污染物，并且由于氢氧化铁的形成而可延长持续时间而不堵塞。

公开(公告)号：US07824738B2

公开(公告)日：2010-11-02

申请号：US11587857

申请日：2005-02-04

申请人： John Smith ,  Sharad Chandra

发明人： John Smith ,  Sharad Chandra

IPC分类号： B05D3/00

CPC分类号： C23C10/52 ,  C23C10/38 ,  C23C10/42 ,  C23C10/48 ,  C23C10/50

摘要： This invention relates to the simultaneous treatment of the internal and external surfaces of turbine blades or vanes. In particular it provides a process for coating an external and an internal surface of a turbine blade or vane with aluminium and chromium, respectively, at substantially the same time. The process comprises the following steps (i) and (ii) in either order: (i) applying to the external surface an aluminising compound comprising aluminium, a moderator, an energiser and a diluent; and (ii) applying to the internal surface a chromising compound comprising chromium, an energiser and a diluent. These steps are followed by (iii) heating the turbine blade or vane to form an aluminium layer on the external surface and a chromium layer on the internal surface. The invention also provides a suitable aluminising compound and a chromising compound per se.

摘要翻译： 本发明涉及同时处理涡轮叶片或叶片的内表面和外表面。 特别地，它提供了一种在大致相同的时间分别用铝和铬涂覆涡轮叶片或叶片的外表面和内表面的方法。 该方法按以下顺序包括以下步骤（i）和（ii）：（i）向外表面施加包含铝，慢化剂，激发剂和稀释剂的铝化合物; 和（ii）向内表面施加包含铬，能量器和稀释剂的铬化合物。 这些步骤之后是（iii）加热涡轮机叶片或叶片以在外表面上形成铝层，并在内表面上形成铬层。 本发明还提供合适的铝化合物和铬化合物本身。