Invention Application
- Patent Title: Die module system and method
- Patent Title (中): 模块模块系统和方法
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Application No.: US11157565Application Date: 2005-06-21
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Publication No.: US20060050498A1Publication Date: 2006-03-09
- Inventor: James Cady , Paul Goodwin
- Applicant: James Cady , Paul Goodwin
- Assignee: Staktek Group L.P.
- Current Assignee: Staktek Group L.P.
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.
Public/Granted literature
- US07423885B2 Die module system Public/Granted day:2008-09-09
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