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    Thin Module System and Method
    2.
    发明申请
    Thin Module System and Method 有权
    薄模块系统和方法

    公开(公告)号：US20070115017A1

    公开(公告)日：2007-05-24

    申请号：US11624608

    申请日：2007-01-18

    Applicant: Paul Goodwin ,  James Cady ,  Douglas Wehrly

    Inventor： Paul Goodwin ,  James Cady ,  Douglas Wehrly

    IPC: G01R31/02

    CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.

    Abstract translation: 柔性电路具有用于安装在插座或卡缘连接器中的触点。 柔性电路包括安装在边缘连接器触头两侧的集成电路器件。 优选地，柔性电路围绕刚性基板的边缘缠绕，并且在基板的两侧上提供用于安装在插座中的触点。 可以用相同的策略覆盖多个柔性电路。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。

    Compact module system and method
    7.
    发明申请
    Compact module system and method 有权

    公开(公告)号：US20060050592A1

    公开(公告)日：2006-03-09

    申请号：US11187269

    申请日：2005-07-22

    Applicant: James Cady ,  James Wehrly ,  Paul Goodwin

    Inventor： James Cady ,  James Wehrly ,  Paul Goodwin

    IPC: G11C8/00

    CPC classification number: H05K1/189 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10189

    Abstract: A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.

    Minimized profile circuit module systems and methods
    8.
    发明申请
    Minimized profile circuit module systems and methods 审中-公开
    最小化配置文件电路模块系统和方法

    公开(公告)号：US20060048385A1

    公开(公告)日：2006-03-09

    申请号：US11242962

    申请日：2005-10-04

    Applicant: James Cady ,  James Wehrly ,  Paul Goodwin

    Inventor： James Cady ,  James Wehrly ,  Paul Goodwin

    IPC: H01R43/02

    CPC classification number: G11C5/143 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  Y10T29/4913 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: Flexible circuitry is populated on one or both sides with integrated circuits (ICs) each of which ICs has an IC profile (height). A substantially flat, windowed fixture with a fixture profile less than the IC profiles of the ICs is applied over an IC-populated side of the flexible circuitry causing at least a part of the ICs to emerge from respective fixture windows. Material is removed simultaneously from that portion of the ICs that emerge from the windows to result in lower-profile ICs which, in a preferred embodiment exhibit profiles substantially coincident with the fixture profile established by the upper surface of the fixture. The method is used to advantage in devising circuit modules by disposing the flexible circuitry about a rigid substrate to form the circuit module with a low profile. Some embodiments use substrates that are windowed or have inset areas into which the lower profile CSPs may be set to reach profile requirements.

    Abstract translation: 灵活的电路在一侧或两侧安装集成电路（IC），每个IC都具有IC配置文件（高度）。 具有小于IC的IC轮廓的夹具轮廓的基本平坦的窗口固定件被施加在柔性电路的IC填充侧上，导致至少一部分IC从相应的固定窗口出来。 从窗口出现的IC的那部分同时移除材料以产生较小轮廓的IC，其在优选实施例中表现出与由固定装置的上表面确定的夹具轮廓基本一致的轮廓。 该方法用于通过将柔性电路围绕刚性衬底设置以形成具有低轮廓的电路模块来设计电路模块。 一些实施例使用被窗口化或具有插入区域的衬底，下部轮廓CSP可设置到其中以达到轮廓要求。

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