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发明申请
US20060055037A1 Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip 失效
微电子器件芯片包括混合Au凸块，封装相同，LCD装置包括微电子器件芯片和制造微电子器件芯片的方法

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
摘要：
A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.
摘要（中）：

提供了一种包括在电模分类（EDS）测试中在探针尖端中不产生异物的混合Au凸块的微电子器件芯片。 微电子器件芯片包括芯片焊盘，其连接到形成在衬底上的微电子器件，并且微电子器件与芯片的外部电接触。 此外，微电子器件芯片包括形成在芯片焊盘上并由包括两层或更多层的复合层构成的凸块。

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