公开(公告)号：US07282801B2

公开(公告)日：2007-10-16

申请号：US11226797

申请日：2005-09-14

申请人： Hyung-keun Park ,  Woo-jin Jang ,  Young-ho Kim ,  Tae-sung Moon

发明人： Hyung-keun Park ,  Woo-jin Jang ,  Young-ho Kim ,  Tae-sung Moon

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.

摘要翻译： 提供了一种包括在电模分类（EDS）测试中在探针尖端中不产生异物的混合Au凸块的微电子器件芯片。 微电子器件芯片包括芯片焊盘，其连接到形成在衬底上的微电子器件，并且微电子器件与芯片的外部电接触。 此外，微电子器件芯片包括形成在芯片焊盘上并由包括两层或更多层的复合层构成的凸块。

公开(公告)号：US20060055037A1

公开(公告)日：2006-03-16

申请号：US11226797

申请日：2005-09-14

申请人： Hyung-keun Park ,  Woo-jin Jang ,  Young-ho Kim ,  Tae-sung Moon

发明人： Hyung-keun Park ,  Woo-jin Jang ,  Young-ho Kim ,  Tae-sung Moon

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.

摘要翻译： 提供了一种包括在电模分类（EDS）测试中在探针尖端中不产生异物的混合Au凸块的微电子器件芯片。 微电子器件芯片包括芯片焊盘，其连接到形成在衬底上的微电子器件，并且微电子器件与芯片的外部电接触。 此外，微电子器件芯片包括形成在芯片焊盘上并由包括两层或更多层的复合层构成的凸块。

公开(公告)号：US20070080453A1

公开(公告)日：2007-04-12

申请号：US11542283

申请日：2006-10-03

申请人： Woo-jin Jang ,  Seung-won Lee

发明人： Woo-jin Jang ,  Seung-won Lee

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/13099 ,  H01L2224/13166 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/01074 ,  H01L2224/05599

摘要： A semiconductor chip includes a plurality of chip pads and a plurality of bumps formed on respective chip pads, each bumps including a bump main body and a conductive particle disposed on the bump main body and exposed to the air, the conductive particle including an elastic portion made of an elastic material and a conductive layer enclosing the elastic portion.

摘要翻译： 半导体芯片包括多个芯片焊盘和形成在各个芯片焊盘上的多个凸块，每个凸块包括设置在凸块主体上并暴露于空气的凸块主体和导电颗粒，导电颗粒包括弹性部分 由弹性材料制成，导电层由弹性部分包围。