Localized temperature increases inside integrated circuits due to heating at operation are prevented or controlled by electronic devices or wirings with CPP (current-perpendicular-to-plane) structure which has a current cooling effect. The CPP structure refers to a structure comprising a columnar electrically conductive portion and an insulator portion surrounding the conductive portion. The columnar portion is formed from the multilayered structure in a direction perpendicular to the plane of the layers, so as to allow a current to flow from an upper layer to a lower layer (or vice versa). The cooling effect is induced by current at the interface (or a plural of interfaces) of appropriately selected different kinds of materials (which are conductive substances in general, such as metals, semiconductors, and alloys thereof) in the columnar portion due to the Peltier effect when a current flows through the column. Temperature in minute range is detected by thermocouple with CPP structure. The thermocouple has two interfaces of different materials with a proper combination. When a temperature difference exists between two interfaces, a voltage which corresponds to product of the temperature difference and the Peltier coefficient at the interface is produced. In the same manner, the intensity of inferred can be also measured.