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    Electronic device and wiring with a current induced cooling effect, and an electronic device capable of converting a temperature difference into voltage
    1.
    发明授权
    Electronic device and wiring with a current induced cooling effect, and an electronic device capable of converting a temperature difference into voltage 失效
    具有电流感应冷却效果的电子设备和布线以及能够将温差转换为电压的电子设备

    公开(公告)号：US07556869B2

    公开(公告)日：2009-07-07

    申请号：US11221863

    申请日：2005-09-09

    申请人： Akio Fukushima ,  Hitoshi Kubota ,  Atsushi Yamamoto

    发明人： Akio Fukushima ,  Hitoshi Kubota ,  Atsushi Yamamoto

    IPC分类号： G11B5/39 ,  G11C5/06 ,  G11C5/14

    CPC分类号： G11C11/16 ,  G11B5/3903 ,  G11B5/40 ,  H01L23/38 ,  H01L43/08 ,  H01L2924/0002 ,  Y10T428/1193 ,  H01L2924/00

    摘要： Localized temperature increases inside integrated circuits due to heating at operation are prevented or controlled by electronic devices or wirings with CPP (current-perpendicular-to-plane) structures which have a current cooling effect. A CPP structure refers to a structure comprising a columnar electrically conductive portion and an insulator portion surrounding the conductive portion. The columnar portion is formed from a multilayered structure in a direction perpendicular to the plane of the layers, so as to allow a current to flow from an upper layer to a lower layer (or vice versa). The cooling effect is induced by current at the interface (or a plural of interfaces) of appropriately selected different kinds of materials (which are conductive substances in general, such as metals, semiconductors, and alloys thereof) in the columnar portion due to the Peltier effect when a current flows through the column. Temperature in a minute range is detected by a thermocouple with the CPP structure. The thermocouple has two interfaces of different materials with a proper combination. When a temperature difference exists between the two interfaces, a voltage which corresponds to a product of the temperature difference and the Peltier coefficient at the interface is produced. In the same manner, the intensity of the infrared can be also measured.

    摘要翻译： 通过具有当前冷却效果的CPP（电流 - 垂直 - 平面）结构的电子设备或配线来防止或控制由于操作中的加热而导致集成电路内的局部温度升高。 CPP结构是指包括柱状导电部分和围绕导电部分的绝缘体部分的结构。 柱状部分由与层的平面垂直的方向由多层结构形成，从而允许电流从上层流向下层（反之亦然）。 由于珀尔帖（Peltier），在柱状部分中适当选择的不同种类的材料（通常为导电物质，例如金属，半导体及其合金）的界面（或多个界面）处的电流引起了冷却效应。 当电流流过色谱柱时产生影响。 通过具有CPP结构的热电偶检测微小范围内的温度。 热电偶具有不同材料的两个接口，并具有适当的组合。 当在两个界面之间存在温度差时，产生对应于界面处的温差和珀尔帖系数的乘积的电压。 以相同的方式，还可以测量红外线的强度。

    Electronic device and wiring with a current induced cooling effect, and an electronic device capable of converting a temperature difference into voltage
    2.
    发明申请
    Electronic device and wiring with a current induced cooling effect, and an electronic device capable of converting a temperature difference into voltage 失效
    具有电流感应冷却效果的电子设备和布线以及能够将温差转换为电压的电子设备

    公开(公告)号：US20060056113A1

    公开(公告)日：2006-03-16

    申请号：US11221863

    申请日：2005-09-09

    申请人： Akio Fukushima ,  Hitoshi Kubota ,  Atsushi Yamamoto

    发明人： Akio Fukushima ,  Hitoshi Kubota ,  Atsushi Yamamoto

    IPC分类号： G11B5/33 ,  G11B5/127

    CPC分类号： G11C11/16 ,  G11B5/3903 ,  G11B5/40 ,  H01L23/38 ,  H01L43/08 ,  H01L2924/0002 ,  Y10T428/1193 ,  H01L2924/00

    摘要： Localized temperature increases inside integrated circuits due to heating at operation are prevented or controlled by electronic devices or wirings with CPP (current-perpendicular-to-plane) structure which has a current cooling effect. The CPP structure refers to a structure comprising a columnar electrically conductive portion and an insulator portion surrounding the conductive portion. The columnar portion is formed from the multilayered structure in a direction perpendicular to the plane of the layers, so as to allow a current to flow from an upper layer to a lower layer (or vice versa). The cooling effect is induced by current at the interface (or a plural of interfaces) of appropriately selected different kinds of materials (which are conductive substances in general, such as metals, semiconductors, and alloys thereof) in the columnar portion due to the Peltier effect when a current flows through the column. Temperature in minute range is detected by thermocouple with CPP structure. The thermocouple has two interfaces of different materials with a proper combination. When a temperature difference exists between two interfaces, a voltage which corresponds to product of the temperature difference and the Peltier coefficient at the interface is produced. In the same manner, the intensity of inferred can be also measured.

    摘要翻译： 通过具有电流冷却效果的具有CPP（电流 - 垂直 - 平面）结构的电子设备或配线来防止或控制由于操作中的加热而导致集成电路内的局部温度升高。 CPP结构是指包括柱状导电部分和围绕导电部分的绝缘体部分的结构。 柱状部分由垂直于层平面的方向由多层结构形成，从而允许电流从上层流向下层（反之亦然）。 由于珀尔帖（Peltier），在柱状部分中适当选择的不同种类的材料（通常为导电物质，例如金属，半导体及其合金）的界面（或多个界面）处的电流引起了冷却效应。 当电流流过色谱柱时产生影响。 微波范围内的温度由具有CPP结构的热电偶检测。 热电偶具有不同材料的两个接口，并具有适当的组合。 当两个界面之间存在温差时，产生与界面上的温差和珀耳帖系数的乘积相对应的电压。 以同样的方式，推测的强度也可以测量。