Invention Application
US20060057297A1 Silicone resins 失效
硅树脂

Silicone resins
Abstract:
A silicone resin, curable to a resin of low coefficient of thermal expansion, high glass transition temperature and high modulus, has the empirical formula (R3SiO2)a(R2SiO2/2)b(RsiO3/2)c(SiO4/2)d wherein each R is a hydrocarbon or substituted hydrocarbon group or a hydrogen atom; and a=0.02 to 0.8; b=0 to 0.4; and c+d=0.2 to 0.98, where a+b+c+d=1.0, characterized in that at least 2 mole % of the siloxane units in the resin are of the formula R′3SiO1/2 RR′2Sio1/2 or R′2SiO2/2 wherein each R′ is an alkenyl group.
Public/Granted literature
Information query
Patent Agency Ranking
0/0