An object of the present invention is to provide a conductive resin composition which does not cause problems with regard to moldability such as occurrence of separation between a resin component and a conductive filler, voids and warp on molding, and is excellent in filling of a resin into a mold, and is also capable of being used for various electrical and electronic materials, including a separator for a fuel cell having excellent properties. To achieve the above object, the present invention provides a conductive resin composition comprising a conductive filler (A); a urethane-modified epoxy (meth)acrylate (B) obtained by reacting an epoxy (meth)acrylate (b-1), which is obtained by the addition reaction of an epoxy resin having an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and a (meth)acrylic acid, with a polyisocyanate (b-2); a (meth)acrylate (C) having a number average molecular weight of 500 to 10,000, which contains 20 to 80% by weight of an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and contains no active hydrogen atom; and the other ethylenically unsaturated monomer (D) which is copolymerizable with the urethane-modified epoxy (meth)acrylate (B) and the (meth)acrylate (C).