公开(公告)号：US20080043364A1

公开(公告)日：2008-02-21

申请号：US11650727

申请日：2007-01-08

申请人： Toshiya Kato ,  Masanori Fukushi

发明人： Toshiya Kato ,  Masanori Fukushi

IPC分类号： G11B5/00 ,  G11B21/02

CPC分类号： G11B5/59655 ,  G11B5/59638

摘要： There is provided a servo information recording device having a simple structure, being implementable in lower cost, and capable of writing servo information with high reliability and a servo information recording method.A servo information recording device comprises: a head swingably supported relative to a predetermined swing axis; a head drive section that swings the head within a predetermined zone in the radial direction of the disk medium; and a controller that controls the head drive section and writes the servo information onto a track of the disk medium. Assuming that R is the outer circumferential radius of the disk medium and P is a distance between the center of the disk medium and pivot (swing axis), the swing axis is disposed at a position at which P/R falls beyond about 1.35.

摘要翻译： 提供了一种具有简单结构的伺服信息记录装置，可以以较低的成本实现，并且能够以高可靠性写入伺服信息和伺服信息记录方法。 伺服信息记录装置包括：相对于预定的摆动轴线可摆动地支撑的头部; 头驱动部，其在盘介质的径向方向上的预定区域内使头部摆动; 以及控制器，其控制磁头驱动部分并将伺服信息写入到磁盘介质的磁道上。 假设R是盘介质的外周半径，P是盘介质的中心和枢轴（摆动轴）之间的距离，则摆动轴设置在P / R下降超过1.35左右的位置。

公开(公告)号：US07567405B2

公开(公告)日：2009-07-28

申请号：US11650727

申请日：2007-01-08

申请人： Toshiya Kato ,  Masanori Fukushi

发明人： Toshiya Kato ,  Masanori Fukushi

IPC分类号： G11B20/20 ,  G11B21/02

CPC分类号： G11B5/59655 ,  G11B5/59638

摘要： There is provided a servo information recording device having a simple structure, being implementable in lower cost, and capable of writing servo information with high reliability and a servo information recording method. The servo information recording device includes a head swingably supported relative to a predetermined swing axis and a head drive section that swings the head within a predetermined zone in the radial direction of the disk medium. The device also has a controller that controls the head drive section and writes the servo information onto a track of the disk medium. Assuming that R is the outer circumferential radius of the disk medium and P is a distance between the center of the disk medium and pivot (swing axis), the swing axis is disposed at a position at which P/R falls beyond about 1.35.

摘要翻译： 提供了一种具有简单结构的伺服信息记录装置，可以以较低的成本实现，并且能够以高可靠性写入伺服信息和伺服信息记录方法。 伺服信息记录装置包括相对于预定摆动轴线可摆动地支撑的头部和在盘介质的径向方向上的预定区域内使头部摆动的头部驱动部分。 该装置还具有控制头驱动部分并将伺服信息写入磁盘介质的轨道上的控制器。 假设R是盘介质的外周半径，P是盘介质的中心和枢轴（摆动轴）之间的距离，则摆动轴设置在P / R下降超过1.35左右的位置。

公开(公告)号：US07304820B2

公开(公告)日：2007-12-04

申请号：US10646224

申请日：2003-08-22

申请人： Toshiya Kato ,  Terushige Arai ,  Masanori Fukushi

发明人： Toshiya Kato ,  Terushige Arai ,  Masanori Fukushi

IPC分类号： G11B17/02 ,  G11B5/012

CPC分类号： G11B17/038 ,  G11B25/043 ,  H02K7/003 ,  H02K15/00 ,  Y10T29/49009 ,  Y10T29/49025

摘要： The method of positioning a disk-shaped medium is capable of precisely positioning the center of the disk-shape medium with respect to a center of a rotary shaft. The method comprises the steps of: inserting a cylindrical hub into a center hole of the disk-shaped medium; and covering a hub adaptor, which is eccentrically fixed to a rotary shaft, with the hub so as to position the disk-shaped medium on the rotary shaft. Directions of eccentricity of the disk-shaped medium, the hub and a hub unit are defined on the basis of amount of eccentricity between the disk-shaped medium and the hub, that between the hub and the hub adaptor and that between the hub adaptor and the rotary shaft.

摘要翻译： 定位盘状介质的方法能够相对于旋转轴的中心精确地定位盘形介质的中心。 该方法包括以下步骤：将圆柱形轮毂插入盘状介质的中心孔中; 并且将所述轮毂适配器覆盖在所述轮毂适配器上，所述轮毂适配器与所述轮毂偏心地固定到旋转轴，以将所述盘形介质定位在所述旋转轴上。 基于盘形介质和轮毂之间的偏心量，轮毂和轮毂适配器之间的偏心量以及轮毂适配器和轮毂适配器之间的偏心量来定义盘形介质，轮毂和轮毂单元的偏心方向 旋转轴。

公开(公告)号：US20060060824A1

公开(公告)日：2006-03-23

申请号：US10532084

申请日：2004-03-05

申请人： Takashi Yasumura ,  Toshiya Kato ,  Kenichi Hamada ,  Tetsuya Harada

发明人： Takashi Yasumura ,  Toshiya Kato ,  Kenichi Hamada ,  Tetsuya Harada

IPC分类号： H01M8/02 ,  H01B1/12

CPC分类号： C08F290/067 ,  H01B1/20 ,  H01M8/0221 ,  H01M8/0226 ,  H01M2008/1095 ,  Y02P70/56

摘要： An object of the present invention is to provide a conductive resin composition which does not cause problems with regard to moldability such as occurrence of separation between a resin component and a conductive filler, voids and warp on molding, and is excellent in filling of a resin into a mold, and is also capable of being used for various electrical and electronic materials, including a separator for a fuel cell having excellent properties. To achieve the above object, the present invention provides a conductive resin composition comprising a conductive filler (A); a urethane-modified epoxy (meth)acrylate (B) obtained by reacting an epoxy (meth)acrylate (b-1), which is obtained by the addition reaction of an epoxy resin having an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and a (meth)acrylic acid, with a polyisocyanate (b-2); a (meth)acrylate (C) having a number average molecular weight of 500 to 10,000, which contains 20 to 80% by weight of an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and contains no active hydrogen atom; and the other ethylenically unsaturated monomer (D) which is copolymerizable with the urethane-modified epoxy (meth)acrylate (B) and the (meth)acrylate (C).

摘要翻译： 本发明的目的是提供一种导电性树脂组合物，其不会引起树脂成分与导电性填料的分离发生等成型性，成型后的空隙和翘曲等问题，树脂的填充性优异 并且还能够用于各种电气和电子材料，包括具有优异性能的燃料电池用隔板。 为了实现上述目的，本发明提供一种包含导电填料（A）的导电树脂组合物。 通过使具有芳香族环状结构单元的环氧树脂和/或脂肪族环状结构单元的加成反应得到的环氧（甲基）丙烯酸酯（b-1）与环氧（甲基）丙烯酸酯 结构单元和（甲基）丙烯酸，与多异氰酸酯（b-2）; 数均分子量为500〜10000的（甲基）丙烯酸酯（C），含有20〜80重量％的芳香族环状结构单元和/或脂肪族环状结构单元，不含有活性氢原子; 和可与氨基甲酸酯改性的环氧（甲基）丙烯酸酯（B）和（甲基）丙烯酸酯（C））共聚的其它烯属不饱和单体（D）。

公开(公告)号：US06969750B2

公开(公告)日：2005-11-29

申请号：US10088107

申请日：2001-07-26

申请人： Hisakazu Tanaka ,  Toshiya Kato ,  Shigeki Ideguchi ,  Hideyuki Ishizu ,  Yoshiki Hasegawa

发明人： Hisakazu Tanaka ,  Toshiya Kato ,  Shigeki Ideguchi ,  Hideyuki Ishizu ,  Yoshiki Hasegawa

IPC分类号： A61L15/60 ,  C08F283/04 ,  C08F290/14 ,  C08F26/06

CPC分类号： C08F290/145 ,  A61L15/60 ,  C08F283/04 ,  C08F290/14 ,  Y10T442/673 ,  Y10T442/699 ,  C08L51/08

摘要： The water absorbent material of the present invention is composed of a copolymer of an anhydropolyamino acid having at least one ethylenically unsaturated double bond in a molecule, a water-soluble monomer having an ethylenically unsaturated double bond and polysaccharides, and has high water absorption ratio and high water absorption rate in pure water or water having a low ion content and also has high absorption properties for high concentration salt-containing solutions.

公开(公告)号：US07858696B2

公开(公告)日：2010-12-28

申请号：US10532084

申请日：2004-03-05

申请人： Takashi Yasumura ,  Toshiya Kato ,  Kenichi Hamada ,  Tetsuya Harada

发明人： Takashi Yasumura ,  Toshiya Kato ,  Kenichi Hamada ,  Tetsuya Harada

IPC分类号： H01M8/02 ,  H01M8/00 ,  H01B1/12 ,  H01B1/20

CPC分类号： C08F290/067 ,  H01B1/20 ,  H01M8/0221 ,  H01M8/0226 ,  H01M2008/1095 ,  Y02P70/56

摘要： An object of the present invention is to provide a conductive resin composition which does not cause problems with regard to moldability such as occurrence of separation between a resin component and a conductive filler, voids and warp on molding, and is excellent in filling of a resin into a mold, and is also capable of being used for various electrical and electronic materials, including a separator for a fuel cell having excellent properties. To achieve the above object, the present invention provides a conductive resin composition comprising a conductive filler (A); a urethane-modified epoxy (meth)acrylate (B) obtained by reacting an epoxy (meth)acrylate (b-1), which is obtained by the addition reaction of an epoxy resin having an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and a (meth)acrylic acid, with a polyisocyanate (b-2); a (meth)acrylate (C) having a number average molecular weight of 500 to 10,000, which contains 20 to 80% by weight of an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and contains no active hydrogen atom; and the other ethylenically unsaturated monomer (D) which is copolymerizable with the urethane-modified epoxy (meth)acrylate (B) and the (meth)acrylate (C).

摘要翻译： 本发明的目的是提供一种导电性树脂组合物，其不会引起树脂成分与导电性填料的分离发生等成型性，成型后的空隙和翘曲等问题，树脂的填充性优异 并且还能够用于各种电气和电子材料，包括具有优异性能的燃料电池用隔板。 为了实现上述目的，本发明提供一种包含导电填料（A）的导电树脂组合物。 通过使具有芳香族环状结构单元的环氧树脂和/或脂肪族环状结构单元的加成反应得到的环氧（甲基）丙烯酸酯（b-1）与环氧（甲基）丙烯酸酯 结构单元和（甲基）丙烯酸，与多异氰酸酯（b-2）; 数均分子量为500〜10000的（甲基）丙烯酸酯（C），含有20〜80重量％的芳香族环状结构单元和/或脂肪族环状结构单元，不含有活性氢原子; 和可与氨基甲酸酯改性的环氧（甲基）丙烯酸酯（B）和（甲基）丙烯酸酯（C））共聚的其它烯属不饱和单体（D）。

公开(公告)号：US5355331A

公开(公告)日：1994-10-11

申请号：US185169

申请日：1994-01-24

申请人： Shinsuke Takase ,  Toshiya Kato

发明人： Shinsuke Takase ,  Toshiya Kato

IPC分类号： G11C11/41 ,  G11C5/14 ,  G11C11/413 ,  G11C11/417 ,  G11C29/02 ,  H01L21/66 ,  H01L21/8244 ,  H01L27/11 ,  G11C7/00

CPC分类号： G11C5/14 ,  G11C11/417

摘要： According to this invention, there is disclosed a semiconductor device in which a memory section and a logic section are arranged on the same semiconductor chip, comprising a high-resistance element constituting a memory cell, a low-resistance line connected to the high-resistance element, a power source line serving as a power source path from a power source pad, a switching element arranged between the low-resistance line and the power source line, and a control circuit for controlling the switching element.

摘要翻译： 根据本发明，公开了一种半导体器件，其中存储部分和逻辑部分布置在相同的半导体芯片上，包括构成存储单元的高电阻元件，连接到高电阻的低电阻线 元件，作为来自电源焊盘的电源路径的电源线，布置在低电阻线和电源线之间的开关元件，以及用于控制开关元件的控制电路。

公开(公告)号：US4924290A

公开(公告)日：1990-05-08

申请号：US238122

申请日：1988-08-30

申请人： Motohiro Enkaku ,  Toshiya Kato

发明人： Motohiro Enkaku ,  Toshiya Kato

IPC分类号： H01L21/82 ,  H01L21/822 ,  H01L23/528 ,  H01L23/538 ,  H01L27/04 ,  H01L27/118

CPC分类号： H01L23/5384 ,  H01L23/528 ,  H01L23/5286 ,  H01L24/06 ,  H01L2924/14

摘要： A semiconductor device includes a circuit block formed on a semiconductor chip with multilayered wiring layers having two or more layers, and having a specific function assigned thereto, a first current path pattern formed in a first layer of the multilayered wiring layers and running around the circuit block, a second current path pattern formed in a second layer of the multilayered wiring layers and running around the circuit block, part of the second current path pattern lying over the first current path pattern and the other portion of the second current path pattern lying off the first current path pattern so as to define a connection space with a predetermined width between the first current path pattern and the second current path pattern, a first signal path pattern formed in the first layer of the multilayered wiring layers and serving as a signal path to the circuit block, a second signal path pattern formed in the second layer of the multilayered wiring layers and serving as the signal path to the circuit block, and a via contact, formed in the connection space, for electrically coupling the first signal path pattern and the second signal path pattern.

公开(公告)号：US20050171309A1

公开(公告)日：2005-08-04

申请号：US11098415

申请日：2005-04-05

申请人： Hisakazu Tanaka ,  Toshiya Kato ,  Shigeki Ideguchi ,  Hideyuki Ishizu ,  Yoshiki Hasegawa

发明人： Hisakazu Tanaka ,  Toshiya Kato ,  Shigeki Ideguchi ,  Hideyuki Ishizu ,  Yoshiki Hasegawa

IPC分类号： A61L15/60 ,  C08F283/04 ,  C08F290/14 ,  C08F26/00

CPC分类号： C08F290/145 ,  A61L15/60 ,  C08F283/04 ,  C08F290/14 ,  Y10T442/673 ,  Y10T442/699 ,  C08L51/08

摘要： The water absorbent material of the present invention is composed of a copolymer of an anhydropolyamino acid having at least one ethylenically unsaturated double bond in a molecule, a water-soluble monomer having an ethylenically unsaturated double bond and polysaccharides, and has high water absorption ratio and high water absorption rate in pure water or water having a low ion content and also has high absorption properties for high concentration salt-containing solutions.

摘要翻译： 本发明的吸水材料由分子中具有至少一个烯键式不饱和双键的脱氢氨基酸，具有烯属不饱和双键的水溶性单体和多糖的共聚物组成，具有高吸水率和 在纯水或离子含量低的水中吸水率高，对高浓度含盐溶液也具有高吸收性能。

公开(公告)号：US4970572A

公开(公告)日：1990-11-13

申请号：US318791

申请日：1989-03-03

申请人： Toshiya Kato ,  Motohiro Enkaku

发明人： Toshiya Kato ,  Motohiro Enkaku

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L23/522 ,  H01L23/528

CPC分类号： H01L23/5286 ,  H01L23/5226 ,  H01L24/06 ,  H01L2224/05554 ,  H01L2924/14

摘要： A semiconductor integrated circuit device of multi-layer interconnection structure includes a pad formed of a multilayer interconnection layer. The power source pad is connected to a power source interconnection layer via a lead-out interconnection layer which is formed of the same multilayer interconnection layer as that used to form the power source pad.