- 专利标题: Electronic circuit including circuit-connecting material
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申请号: US11227212申请日: 2005-09-16
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公开(公告)号: US20060060969A1公开(公告)日: 2006-03-23
- 发明人: Itsuo Watanabe , Tohru Fujinawa , Motohiro Arifuku , Houko Kanazawa , Atsushi Kuwano
- 申请人: Itsuo Watanabe , Tohru Fujinawa , Motohiro Arifuku , Houko Kanazawa , Atsushi Kuwano
- 申请人地址: JP Shinjuku-ku
- 专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人地址: JP Shinjuku-ku
- 优先权: JP09-079422 19970331; JP09-079424 19970331; JP09-252933 19970918
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
公开/授权文献
- US07604868B2 Electronic circuit including circuit-connecting material 公开/授权日:2009-10-20
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