公开(公告)号：US20110300326A1

公开(公告)日：2011-12-08

申请号：US13143159

申请日：2010-02-24

申请人： Takashi Tatsuzawa ,  Takashi Seki ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Kotaro Seki

发明人： Takashi Tatsuzawa ,  Takashi Seki ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Kotaro Seki

IPC分类号： C09J7/02 ,  B32B3/16

CPC分类号： H01R4/04 ,  B65H18/28 ,  B65H2701/377 ,  C09J7/22 ,  C09J7/38 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0191

摘要： The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.

摘要翻译： 根据本发明的接合材料卷轴包括具有带状基材的电路连接带和形成在基材的一个表面上的粘合层，以及缠绕有用于电路连接的带的芯，其中 用于电路连接的带具有已经结合到终端的端带，其中粘合剂层不形成在芯的至少一个卷轴长度上的区域朝向端子的电路连接用带的起始端 以及设置成覆盖该区域的盖带。

公开(公告)号：US08029911B2

公开(公告)日：2011-10-04

申请号：US12847819

申请日：2010-07-30

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： H05K3/32 ,  H05K1/14 ,  H01L21/60 ,  H01L21/50 ,  C09J7/00

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US20100330364A1

公开(公告)日：2010-12-30

申请号：US12874945

申请日：2010-09-02

申请人： Motohiro ARIFUKU ,  Itsuo WATANABE ,  Kouji MOTOMURA ,  Kouji KOBAYASHI ,  Yasushi GOTOH ,  Tohru FUJINAWA

发明人： Motohiro ARIFUKU ,  Itsuo WATANABE ,  Kouji MOTOMURA ,  Kouji KOBAYASHI ,  Yasushi GOTOH ,  Tohru FUJINAWA

IPC分类号： C09J7/02

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

公开(公告)号：US20100294551A1

公开(公告)日：2010-11-25

申请号：US12847819

申请日：2010-07-30

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： H05K1/02 ,  B32B7/10 ,  B32B37/14

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US07604868B2

公开(公告)日：2009-10-20

申请号：US11227212

申请日：2005-09-16

申请人： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atushi Kuwano

发明人： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atushi Kuwano

IPC分类号： B32B27/00 ,  B32B27/26 ,  C09J11/00

CPC分类号： H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C09D5/24 ,  C09D175/16 ,  H01B1/20 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  Y10T428/10 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31942 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

摘要翻译： 一种电路连接材料，其插入在彼此面对的电路电极之间，并且通过将相对的电极彼此相压来使按压方向的电极电连接; 电路连接材料包括作为必要组分（1）加热时能够产生自由基的固化剂，（2）分子量为10,000以上的含羟基树脂和（3）可自由基聚合物质 。 还提供了使用这种材料的电路端子连接结构和电路端子连接方法。

公开(公告)号：US07241644B2

公开(公告)日：2007-07-10

申请号：US11074718

申请日：2005-03-09

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

摘要翻译： 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。

公开(公告)号：US20060060969A1

公开(公告)日：2006-03-23

申请号：US11227212

申请日：2005-09-16

申请人： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

发明人： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

IPC分类号： H01L23/52

CPC分类号： H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C09D5/24 ,  C09D175/16 ,  H01B1/20 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  Y10T428/10 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31942 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

公开(公告)号：US20060014860A1

公开(公告)日：2006-01-19

申请号：US11227186

申请日：2005-09-16

申请人： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

发明人： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

IPC分类号： C08K5/00

CPC分类号： H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C09D5/24 ,  C09D175/16 ,  H01B1/20 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  Y10T428/10 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31942 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

公开(公告)号：US20050178502A1

公开(公告)日：2005-08-18

申请号：US11074718

申请日：2005-03-09

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC分类号： H05K3/34 ,  C09J4/06 ,  H01L21/60 ,  H05K3/32 ,  H05K3/36 ,  C09J1/00

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

摘要翻译： 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。

公开(公告)号：US20050176882A1

公开(公告)日：2005-08-11

申请号：US11074704

申请日：2005-03-09

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC分类号： H05K3/34 ,  C09J4/06 ,  H01L21/60 ,  H05K3/32 ,  H05K3/36 ,  C08K5/54

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.