Invention Application
- Patent Title: Radiant energy heating for die attach
- Patent Title (中): 辐射能量加热用于芯片附着
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Application No.: US10947515Application Date: 2004-09-22
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Publication No.: US20060060979A1Publication Date: 2006-03-23
- Inventor: Kristopher Frutschy
- Applicant: Kristopher Frutschy
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.
Public/Granted literature
- US07187066B2 Radiant energy heating for die attach Public/Granted day:2007-03-06
Information query
IPC分类:
