发明申请
- 专利标题： Method for manufacturing magnetron coated substrates and magnetron sputter source
- 专利标题（中）： 制造磁控溅射基板和磁控溅射源的方法
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申请号： US10952331申请日： 2004-09-28
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公开(公告)号： US20060065525A1公开(公告)日： 2006-03-30
- 发明人: Jurgen Weichart
- 申请人： Jurgen Weichart
- 主分类号： C23C14/00
- IPC分类号： C23C14/00 ; C23C14/32
摘要：
Method for manufacturing magnetron coated substrates, in which along the target and on its backside pointing from the substrate, a magnet arrangement is present by which along the sputter surface of the target at least one closed loop of a tunnel shaped magnetron magnetic field is generated, characterized in that for setting the sputter rate distribution the distance of a part of the magnet arrangement to the backside of the target is changed.
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