发明申请
US20060065937A1 Short channel effect of MOS devices by retrograde well engineering using tilted dopant implantation into recessed source/drain regions 审中-公开
通过逆向井工程使用倾斜掺杂剂注入到凹陷源极/漏极区域中MOS器件的短沟道效应

Short channel effect of MOS devices by retrograde well engineering using tilted dopant implantation into recessed source/drain regions
摘要:
A method of providing a halo implant region in a substrate of a MOS device having a gate electrode thereon and defining source/drain regions, a MOS device fabricated according to the above method, and a system comprising the MOS device. The method comprises: defining undercut recesses in the substrate at the source/drain regions thereof, the undercut recesses extending beneath the gate electrode; creating a halo implant region beneath the gate electrode between the recesses; and providing raised source/drain structures in the undercut recesses after creating the halo implant region.
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