Invention Application
US20060073704A1 Method of forming bump that may reduce possibility of losing contact pad material
审中-公开
形成凸起的方法可以减少失去接触垫材料的可能性
- Patent Title: Method of forming bump that may reduce possibility of losing contact pad material
- Patent Title (中): 形成凸起的方法可以减少失去接触垫材料的可能性
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Application No.: US11210817Application Date: 2005-08-25
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Publication No.: US20060073704A1Publication Date: 2006-04-06
- Inventor: Se-young Jeong , In-young Lee , Sung-min Sim , Young-hee Song , Dong-hyeon Jang , Myeong-soon Park , Sun-young Park , Sun-bum Kim , Hyun-soo Chung
- Applicant: Se-young Jeong , In-young Lee , Sung-min Sim , Young-hee Song , Dong-hyeon Jang , Myeong-soon Park , Sun-young Park , Sun-bum Kim , Hyun-soo Chung
- Priority: KR2004-67094 20040825; KR10-2004-0078094 20050825
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; B44C1/22
Abstract:
A method of forming a bump may involve providing a seed layer on a contact pad of a wafer. A shielding layer and a photosensitive mask layer may be formed on the seed layer. The photosensitive mask layer may be exposed and developed to form a mask pattern. An exposed portion of the shielding layer may be removed. The bump may be formed by plating the exposed seed layer.
Information query
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